Patent Assignment
Reel/Frame 037900/0499
Assignment of Assignor's Interest
Recorded: 2016-03-06
Pages: 3
Assignor
RATHBURN, JAMES
Executed: 2016-02-27
Assignee
HSIO TECHNOLOGIES, LLC
13400 68TH AVENUE NORTH, MAPLE GROVE, MINNESOTA, 55311
Covered Property
(1)
Low Profile Electrical Interconnect with Fusion Bonded Contact Retention and Solder Wick Reduction
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.