Patent Assignment
Reel/Frame 037909/0363
Assignment of Assignor's Interest
Recorded: 2016-03-07
Pages: 3
Assignors
SUNACHI, NAOYA
Executed: 2016-02-18
OSANAI, HIDEYO
Executed: 2016-02-18
KURITA, SATORU
Executed: 2016-02-19
Assignee
DOWA METALTECH CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8617, JAPAN
Covered Property
(1)
Method of Attaching an Electronic Part to a Copper Plate Having a Surface Roughness