Patent Assignment
Reel/Frame 037914/0542
Assignment of Assignor's Interest
Recorded: 2016-03-07
Pages: 3
Assignor
TSAI, SHIANN-TSONG
Executed: 2016-02-19
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Fabrication Method Thereof