Patent Assignment
Reel/Frame 037921/0354
Assignment of Assignor's Interest
Recorded: 2016-03-08
Pages: 3
Assignors
LIN, CHIH-HAN
Executed: 2016-03-01
CHANG, CHE-CHENG
Executed: 2016-03-01
TSENG, HORNG-HUEI
Executed: 2016-03-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Enlarging Spacer Thickness by Forming a Dielectric Layer Over a Recessed Interlayer Dielectric