Patent Assignment
Reel/Frame 037926/0077
Assignment of Assignor's Interest
Recorded: 2016-03-08
Pages: 12
Assignors
HSIAO, CHING-WEN
Executed: 2016-03-04
LIN, TZU-HUNG
Executed: 2016-03-04
PENG, I-HSUAN
Executed: 2016-03-04
HSIEH, TUNG-HSIEN
Executed: 2016-03-04
CHANG, SHENG-MING
Executed: 2016-03-04
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Semiconductor Chip Package Assembly with Improved Heat Dissipation Performance