Patent Assignment
Reel/Frame 037929/0123
Assignment of Assignor's Interest
Recorded: 2016-03-09
Pages: 5
Assignors
YU, CHEN-HUA
Executed: 2016-02-22
SU, AN-JHIH
Executed: 2016-02-22
CHEN, WEI-YU
Executed: 2016-02-19
CHEN, YING-JU
Executed: 2016-02-19
LIN, TSUNG-SHU
Executed: 2016-02-19
CHANG, CHIN-CHUAN
Executed: 2016-02-19
CHEN, HSIEN-WEI
Executed: 2016-02-19
WU, WEI-CHENG
Executed: 2016-02-19
HUANG, LI-HSIEN
Executed: 2016-02-22
WU, CHI-HSI
Executed: 2016-02-22
YEH, DER-CHYANG
Executed: 2016-01-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same