Patent Assignment
Reel/Frame 037960/0147
Assignment of Assignor's Interest
Recorded: 2016-03-11
Pages: 3
Assignors
LEE, SHAO-KUAN
Executed: 2016-02-26
HUANG, HSIN-YEN
Executed: 2016-02-26
CHEN, HAI-CHING
Executed: 2016-02-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Interconnect Structure of Semiconductor Device