Patent Assignment
Reel/Frame 037969/0434
Assignment of Assignor's Interest
Recorded: 2016-03-14
Pages: 6
Assignors
DOANY, FUAD
Executed: 2016-03-10
LEE, BENJAMIN G.
Executed: 2016-03-10
SCHOW, CLINT L.
Executed: 2016-03-14
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Through-Substrate Optical Coupling to Photonics Chips