IP Library › Assignment 038004/0200
Patent Assignment
Reel/Frame 038004/0200

Assignment of Assignor's Interest

Recorded: 2016-03-16 Pages: 9
Assignor
NXP B.V.
Executed: 2015-11-09
Assignee
WEEN SEMICONDUCTORS CO. LTD.
BUILDING 2, NO. 266, HUIREN DADAO, XIAOLAN ECONOMIC DEVELOPMENT ZONE, NANCHANG COUNTY, NANCHANG CITY, JIANGXI PROVINCE, 330200, CHINA
Covered Properties (4)
Semiconductor Device of the Type Sealed in Glass Having a Silver-Copper Bonding Layer Between Slugs and Connection Conductors
Patent: 5,777,388 →
Application: 08/615,924 →
Semiconductor Device Layout
Patent: 6,629,303 →
Application: 10/015,711 →
Publication: US 2002/0110959
Semiconductor Devices and Their Manufacture
Patent: 6,781,156 →
Application: 10/315,804 →
Publication: US 2003/0127645
Over-Temperature Protected Triac and Protection Method
Patent: 8,630,074 →
Application: 13/433,582 →
Publication: US 2012/0250200
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement Supplement Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Release of Security Interest May 9, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 038642/0001 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Patent Release Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
Release of Security Interest Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →
Release of Security Interest Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042762 Frame 0145. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042985 Frame 0001. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
Assignment of Assignor's Interest Aug 24, 2020
From: WEEN SEMICONDUCTORS CO. LTD.
To: WEEN SEMICONDUCTORS CO. LTD.
Reel/Frame 053578/0112 →