IP Library › Assignment 038642/0001
Patent Assignment
Reel/Frame 038642/0001

Release of Security Interest

Recorded: 2016-05-09 Pages: 38
Assignor
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656 AG, NETHERLANDS
Covered Property (1)
Semiconductor Device of the Type Sealed in Glass Having a Silver-Copper Bonding Layer Between Slugs and Connection Conductors
Patent: 5,777,388 →
Application: 08/615,924 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 16, 2016
From: NXP B.V.
To: WEEN SEMICONDUCTORS CO. LTD.
Reel/Frame 038004/0200 →
Release of Security Interest Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →