Patent Assignment
Reel/Frame 038004/0623
Assignment of Assignor's Interest
Recorded: 2016-03-16
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Cmos-Mems Device Structure, Bonding Mesa Structure and Associated Method