Patent Assignment
Reel/Frame 038054/0470
Assignment of Assignor's Interest
Recorded: 2016-03-21
Pages: 5
Assignors
LEE, DOO HWAN
Executed: 2016-03-07
KIM, HYOUNG JOON
Executed: 2016-03-11
KIM, JONG RIP
Executed: 2016-03-07
OH, KYUNG SEOB
Executed: 2016-03-07
SHIN, UNG HUI
Executed: 2016-03-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Package and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.