IP Library › Assignment 049350/0756

Patent Assignment

Reel/Frame 049350/0756

Assignment of Assignor's Interest

Recorded: 2019-06-03 Pages: 8

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Assignor

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Executed: 2019-06-01

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Properties (233)

Electronic Component Package and Method of Manufacturing the Same

Patent: 9,929,100 →

Application: 15/076,174 →

Publication: US 2016/0307847

Electronic Component Package and Method of Manufacturing the Same

Patent: 9,842,789 →

Application: 15/140,775 →

Publication: US 2016/0336249

Electronic Component Package and Method of Manufacturing the Same

Patent: 10,199,337 →

Application: 15/144,162 →

Publication: US 2016/0338202

Electronic Component Package and Package-on-Package Structure Including the Same

Patent: 10,109,588 →

Application: 15/151,885 →

Publication: US 2016/0336296

Electronic Component Package and Method of Manufacturing the Same

Patent: 9,825,003 →

Application: 15/182,376 →

Publication: US 2017/0133293

Electronic Component Package and Electronic Device Including the Same

Patent: 9,859,243 →

Application: 15/183,292 →

Publication: US 2017/0141063

Electronic Component Package and Method of Manufacturing the Same

Patent: 9,905,526 →

Application: 15/192,634 →

Publication: US 2017/0125318

Board for Electronic Component Package, Electronic Component Package, and Method of Manufacturing Board for Electronic Component Package

Patent: 9,831,142 →

Application: 15/200,838 →

Publication: US 2017/0133288

Electronic Component Package and Method of Manufacturing the Same

Patent: 9,741,630 →

Application: 15/201,990 →

Publication: US 2017/0178984

Electronic Component Package and Electronic Device Including the Same

Patent: 10,032,697 →

Application: 15/203,006 →

Publication: US 2017/0162527

Electronic Component Package Having Stress Alleviation Structure

Patent: 10,461,008 →

Application: 15/205,483 →

Publication: US 2017/0178992

Fan-Out Semiconductor Package for Packaging Semiconductor Chip and Capacitors

Patent: 10,373,884 →

Application: 15/278,248 →

Publication: US 2017/0287853

Electronic Component Package and Method of Manufacturing the Same

Application: 15/278,935 →

Publication: US 2017/0207172

Fan-Out Semiconductor Package and Manufacturing Method Thereof

Patent: 10,566,289 →

Application: 15/286,253 →

Publication: US 2017/0103951

Fan-Out Semiconductor Package and Method of Manufacturing the Same

Patent: 9,984,979 →

Application: 15/297,831 →

Publication: US 2017/0040265

Fan-Out Semiconductor Package and Method of Manufacturing the Same

Application: 15/335,120 →

Publication: US 2017/0154838

Fan-Out Semiconductor Package and Electronic Device Including the Same

Patent: 10,128,179 →

Application: 15/336,288 →

Publication: US 2017/0133309

Fan-Out Semiconductor Package and Electronic Device Including the Same

Patent: 10,115,648 →

Application: 15/342,281 →

Publication: US 2017/0148699

Fan-Out Semiconductor Package and Method of Manufacturing Same

Application: 15/352,060 →

Publication: US 2017/0287825

Fan-Out Semiconductor Package and Method of Manufacturing Same

Patent: 10,062,652 →

Application: 15/352,100 →

Publication: US 2017/0271272

Fan-Out Semiconductor Package and Method of Manufacturing Same

Patent: 10,340,153 →

Application: 15/352,668 →

Publication: US 2017/0263573

Fan-Out Semiconductor Package and Method of Manufacturing Same

Patent: 9,899,331 →

Application: 15/353,249 →

Publication: US 2017/0287839

Fan-Out Semiconductor Package

Patent: 9,859,222 →

Application: 15/368,025 →

Publication: US 2017/0358534

Fan-Out Semiconductor Package

Application: 15/369,518 →

Publication: US 2017/0365567

Fan-Out Semiconductor Package

Patent: 10,600,748 →

Application: 15/377,402 →

Publication: US 2017/0365566

Fan-Out Semiconductor Package

Patent: 10,818,621 →

Application: 15/381,635 →

Publication: US 2017/0278812

Electronic Component Package and Method of Manufacturing the Same

Patent: 10,325,856 →

Application: 15/385,414 →

Publication: US 2017/0213794

Fan-Out Semiconductor Package

Patent: 10,403,588 →

Application: 15/402,383 →

Publication: US 2018/0090458

Fan-Out Semiconductor Package

Patent: 10,573,613 →

Application: 15/404,813 →

Publication: US 2018/0061794

Fan-Out Semiconductor Package

Patent: 9,881,873 →

Application: 15/420,558 →

Publication: US 2017/0365558

Fan-Out Semiconductor Package

Patent: 9,824,988 →

Application: 15/432,152 →

Fan-Out Semiconductor Package

Patent: 10,276,467 →

Application: 15/440,181 →

Publication: US 2017/0278766

Fan-Out Semiconductor Package

Patent: 10,892,227 →

Application: 15/441,655 →

Publication: US 2018/0096940

Electronic Component Package

Application: 15/442,927 →

Publication: US 2017/0287796

Electronic Component Package

Patent: 10,020,272 →

Application: 15/448,039 →

Publication: US 2017/0287856

Fan-Out Sensor Package and Camera Module Including the Same

Patent: 10,431,615 →

Application: 15/449,047 →

Publication: US 2018/0090530

Fan-Out Semiconductor Package

Patent: 10,332,855 →

Application: 15/451,880 →

Publication: US 2017/0365572

Fan-Out Semiconductor Package

Patent: 9,929,102 →

Application: 15/453,588 →

Publication: US 2018/0090443

Fan-Out Semiconductor Package

Patent: 9,935,068 →

Application: 15/454,416 →

Publication: US 2017/0365568

Fan-Out Semiconductor Package

Patent: 10,580,728 →

Application: 15/457,260 →

Publication: US 2017/0372995

Fan-Out Semiconductor Package

Patent: 10,134,695 →

Application: 15/459,322 →

Publication: US 2018/0082962

Fan-Out Semiconductor Package

Patent: 10,096,559 →

Application: 15/468,606 →

Publication: US 2018/0076156

Fan-Out Semiconductor Package

Patent: 10,026,681 →

Application: 15/469,709 →

Publication: US 2018/0082933

Fan-Out Semiconductor Package

Patent: 10,229,865 →

Application: 15/471,205 →

Publication: US 2017/0373029

Fan-Out Semiconductor Package Module

Patent: 9,991,219 →

Application: 15/478,374 →

Publication: US 2017/0373035

Fan-Out Semiconductor Package

Patent: 10,043,772 →

Application: 15/489,117 →

Publication: US 2017/0373030

Fan-Out Semiconductor Package

Patent: 10,157,868 →

Application: 15/595,226 →

Publication: US 2018/0061795

Fan-Out Semiconductor Package

Patent: 10,312,205 →

Application: 15/606,467 →

Publication: US 2017/0373027

Fan-Out Semiconductor Package

Patent: 10,050,016 →

Application: 15/627,957 →

Publication: US 2018/0096968

Fan-Out Semiconductor Package and Method of Manufacturing the Fan-Out Semiconductor

Patent: 10,622,322 →

Application: 15/632,138 →

Publication: US 2018/0122759

Fan-Out Semiconductor Package

Patent: 10,170,382 →

Application: 15/633,478 →

Publication: US 2018/0090402

Fan-Out Semiconductor Package and Photosensitive Resin Composition

Patent: 10,283,426 →

Application: 15/637,725 →

Publication: US 2018/0102297

Electronic Component Package and Method of Manufacturing the Same

Patent: 10,002,811 →

Application: 15/647,542 →

Publication: US 2017/0309531

Fan-Out Semiconductor Package

Patent: 10,177,100 →

Application: 15/655,668 →

Publication: US 2018/0145036

Fan-Out Semiconductor Package

Patent: 10,256,192 →

Application: 15/663,042 →

Publication: US 2018/0145033

Fan-Out Semiconductor Package

Patent: 10,083,929 →

Application: 15/666,073 →

Publication: US 2018/0174994

Electronic Component Package and Method of Manufacturing the Same

Patent: 10,170,386 →

Application: 15/667,738 →

Publication: US 2017/0330814

Fan-Out Semiconductor Package

Patent: 10,600,679 →

Application: 15/668,121 →

Publication: US 2018/0138083

Electronic Component Package and Electronic Device Including the Same

Patent: 9,929,117 →

Application: 15/670,711 →

Publication: US 2017/0358548

Fan-Out Semiconductor Package

Patent: 10,026,703 →

Application: 15/679,860 →

Publication: US 2018/0047683

Fan-Out Semiconductor Package

Patent: 10,043,758 →

Application: 15/689,659 →

Publication: US 2018/0226350

Fan-Out Semiconductor Package

Patent: 10,096,552 →

Application: 15/689,861 →

Publication: US 2018/0190591

Electronic Component Package

Patent: 10,304,791 →

Application: 15/707,266 →

Publication: US 2018/0033746

Fan-Out Semiconductor Package

Patent: 10,211,136 →

Application: 15/709,162 →

Publication: US 2018/0096927

Fan-Out Semiconductor Package

Patent: 10,211,149 →

Application: 15/710,374 →

Publication: US 2018/0240751

Fan-Out Semiconductor Package

Patent: 10,269,721 →

Application: 15/711,819 →

Publication: US 2018/0090444

Fan-Out Semiconductor Package

Patent: 10,886,230 →

Application: 15/716,301 →

Publication: US 2018/0096941

Fan-Out Semiconductor Package

Patent: 10,396,049 →

Application: 15/725,179 →

Publication: US 2018/0033751

Fan-Out Semiconductor Package

Patent: 10,224,288 →

Application: 15/728,064 →

Publication: US 2018/0033733

Fan-Out Semiconductor Package Module

Patent: 10,192,844 →

Application: 15/789,685 →

Publication: US 2018/0061801

Board for Electronic Component Package, Electronic Component Package, and Method of Manufacturing Board for Electronic Component Package

Patent: 10,109,541 →

Application: 15/796,411 →

Publication: US 2018/0068911

Semiconductor Device and Method for Manufacturing the Same

Patent: 10,403,579 →

Application: 15/802,131 →

Publication: US 2019/0013276

Passivation Layer Having an Opening for Under Bump Metallurgy

Patent: 10,026,668 →

Application: 15/802,170 →

Fan-Out Semiconductor Package

Patent: 10,177,103 →

Application: 15/807,075 →

Publication: US 2019/0013282

Method of Reducing Warpage of Semiconductor Package Substrate and Device for Reducing Warpage

Patent: 10,546,794 →

Application: 15/816,519 →

Publication: US 2018/0358277

Fan-Out Semiconductor Package

Patent: 10,312,195 →

Application: 15/819,541 →

Publication: US 2019/0019757

Fan-Out Semiconductor Package

Patent: 10,833,041 →

Application: 15/828,948 →

Publication: US 2019/0035758

Fan-Out Sensor Package and Optical Fingerprint Sensor Module Including the Same

Patent: 10,644,046 →

Application: 15/828,993 →

Publication: US 2018/0294299

Fan-Out Semiconductor Package and Package Substrate Comprising the Same

Application: 15/829,045 →

Publication: US 2019/0027419

Fan-Out Semiconductor Package

Patent: 10,096,560 →

Application: 15/837,611 →

Publication: US 2018/0102332

Electronic Component Package and Method of Manufacturing the Same

Application: 15/853,014 →

Publication: US 2018/0138127

Fan-Out Semiconductor Package Module

Patent: 10,340,245 →

Application: 15/870,593 →

Publication: US 2018/0158791

Electronic Component Package and Method of Manufacturing the Same

Patent: 10,256,200 →

Application: 15/877,021 →

Publication: US 2018/0145044

Fan-Out Semiconductor Package Module

Patent: 10,242,973 →

Application: 15/882,440 →

Publication: US 2019/0013300

Fan-Out Semiconductor Package

Patent: 11,075,171 →

Application: 15/891,529 →

Publication: US 2019/0131252

Fan-Out Semiconductor Package

Patent: 10,373,887 →

Application: 15/895,604 →

Publication: US 2019/0088566

Fan-Out Semiconductor Package Module

Patent: 10,475,776 →

Application: 15/900,568 →

Publication: US 2019/0131285

Semiconductor Package

Patent: 10,756,023 →

Application: 15/905,046 →

Publication: US 2019/0122993

Fan-Out Semiconductor Package

Patent: 10,714,437 →

Application: 15/905,062 →

Publication: US 2018/0190602

Fan-Out Semiconductor Package and Method of Manufacturing Same

Patent: 10,388,614 →

Application: 15/913,270 →

Publication: US 2018/0197827

Semiconductor Package

Patent: 10,665,535 →

Application: 15/913,429 →

Publication: US 2019/0131221

Fan-Out Semiconductor Package

Patent: 10,770,418 →

Application: 15/916,785 →

Publication: US 2018/0197832

Carrier Substrate and Method of Manufacturing Semiconductor Package Using the Same

Patent: 10,438,884 →

Application: 15/919,507 →

Publication: US 2019/0164876

Fan-Out Fingerprint Sensor Package

Patent: 10,395,088 →

Application: 15/922,348 →

Publication: US 2018/0307890

Fan-Out Semiconductor Package

Patent: 10,672,719 →

Application: 15/923,708 →

Publication: US 2019/0096824

Semiconductor Package Including Organic Interposer

Patent: 10,600,706 →

Application: 15/925,338 →

Publication: US 2019/0122949

Fan-Out Semiconductor Package

Patent: 10,672,714 →

Application: 15/928,845 →

Publication: US 2019/0164894

Fan-Out Semiconductor Package Module

Patent: 10,192,831 →

Application: 15/933,909 →

Fan-Out Semiconductor Package

Patent: 10,916,495 →

Application: 15/935,526 →

Publication: US 2019/0131224

Fan-Out Semiconductor Package

Patent: 10,304,784 →

Application: 15/938,181 →

Publication: US 2019/0096825

Fan-Out Semiconductor Package

Patent: 10,403,583 →

Application: 15/938,596 →

Publication: US 2019/0051619

Semiconductor Package

Application: 15/940,104 →

Publication: US 2019/0164893

Composite Antenna Substrate and Semiconductor Package Module

Patent: 10,347,598 →

Application: 15/941,334 →

Publication: US 2018/0337148

Fan-Out Semiconductor Package

Patent: 10,756,044 →

Application: 15/941,405 →

Publication: US 2019/0172809

Semiconductor Package

Patent: 10,510,647 →

Application: 15/943,072 →

Publication: US 2019/0189547

Fan-Out Semiconductor Package Module

Patent: 10,403,562 →

Application: 15/943,200 →

Publication: US 2019/0131212

Fan-Out Semiconductor Package and Method of Manufacturing the Same

Patent: 10,262,949 →

Application: 15/944,321 →

Publication: US 2018/0226351

Fan-Out Semiconductor Package

Patent: 10,347,585 →

Application: 15/946,109 →

Publication: US 2019/0122990

Fan-Out Semiconductor Package and Method of Manufacturing the Same

Application: 15/948,535 →

Publication: US 2018/0233433

Antenna Module and Manufacturing Method Thereof

Patent: 10,790,595 →

Application: 15/949,386 →

Publication: US 2019/0173184

Antenna Module

Patent: 10,763,225 →

Application: 15/949,439 →

Publication: US 2019/0139912

Semiconductor Package

Application: 15/950,000 →

Publication: US 2019/0122994

Semiconductor Package Including Organic Interposer

Patent: 10,541,187 →

Application: 15/950,926 →

Publication: US 2019/0139851

Electronic Component Package and Electronic Device Including the Same

Application: 15/955,178 →

Publication: US 2018/0233432

Fan-Out Semiconductor Package

Application: 15/958,370 →

Publication: US 2019/0139920

Fan-Out Sensor Package

Application: 15/958,625 →

Publication: US 2019/0181172

Fan-Out Sensor Package and Camera Module

Patent: 10,475,842 →

Application: 15/962,512 →

Publication: US 2019/0140011

Fan-Out Semiconductor Package and Package on Package Including the Same

Patent: 10,325,891 →

Application: 15/962,577 →

Publication: US 2019/0189600

Semiconductor Package

Patent: 10,483,197 →

Application: 15/962,867 →

Publication: US 2019/0189549

Semiconductor Package for Reducing Stress to Redistribution Via

Patent: 10,734,342 →

Application: 15/965,590 →

Publication: US 2019/0189579

Connection System of Semiconductor Packages

Patent: 10,453,821 →

Application: 15/966,673 →

Publication: US 2019/0043835

Passivation Layer Having Opening for Under Bump Metallurgy

Patent: 10,347,556 →

Application: 15/966,723 →

Publication: US 2019/0013256

Fan-Out Semiconductor Package

Patent: 10,347,613 →

Application: 15/969,359 →

Publication: US 2019/0198486

Fan-Out Semiconductor Package

Patent: 10,396,005 →

Application: 15/969,480 →

Publication: US 2019/0189528

Semiconductor Package

Patent: 10,756,021 →

Application: 15/972,820 →

Publication: US 2019/0122991

Antenna Module

Patent: 10,547,119 →

Application: 15/972,905 →

Publication: US 2019/0173195

Connection System of Semiconductor Packages Using a Printed Circuit Board

Patent: 10,535,643 →

Application: 15/973,927 →

Publication: US 2019/0043847

Semiconductor Package

Patent: 10,446,478 →

Application: 15/976,387 →

Publication: US 2019/0131225

Fan-Out Semiconductor Package

Patent: 10,410,961 →

Application: 15/978,727 →

Publication: US 2019/0131226

Fan-Out Semiconductor Package

Application: 15/978,783 →

Publication: US 2019/0131253

Fan-Out Semiconductor Package

Patent: 10,402,620 →

Application: 15/981,311 →

Publication: US 2019/0130152

Fan-Out Semiconductor Package

Patent: 10,475,748 →

Application: 15/981,651 →

Publication: US 2019/0131242

Electronic Component Package and Method of Manufacturing the Same

Patent: 10,297,553 →

Application: 15/982,839 →

Publication: US 2018/0269156

Fan-Out Semiconductor Package

Patent: 10,438,927 →

Application: 15/986,212 →

Publication: US 2019/0189589

Fan-Out Semiconductor Package

Patent: 10,347,586 →

Application: 15/986,302 →

Publication: US 2019/0164895

Fan-Out Semiconductor Package

Patent: 10,504,825 →

Application: 15/988,541 →

Publication: US 2019/0139876

Fan-Out Semiconductor Package

Application: 15/988,610 →

Publication: US 2019/0164862

Fan-Out Semiconductor Package

Patent: 10,522,497 →

Application: 15/988,647 →

Publication: US 2019/0131270

Fan-Out Semiconductor Package

Patent: 10,453,788 →

Application: 15/988,893 →

Publication: US 2019/0172781

Semiconductor Package

Patent: 10,453,790 →

Application: 15/989,564 →

Publication: US 2019/0122977

Fan-Out Semiconductor Package

Patent: 10,832,986 →

Application: 16/000,094 →

Publication: US 2019/0164863

Board for Electronic Component Package, Electronic Component Package, and Method of Manufacturing Board for Electronic Component Package

Application: 16/000,200 →

Publication: US 2018/0286770

Fan-Out Semiconductor Package

Patent: 10,347,584 →

Application: 16/000,625 →

Publication: US 2019/0206796

Fan-Out Semiconductor Package

Patent: 10,559,540 →

Application: 16/004,007 →

Publication: US 2019/0164908

Semiconductor Package with Improved Flatness of an Insulating Layer Formed on Patterns

Patent: 10,622,273 →

Application: 16/006,368 →

Publication: US 2019/0206755

Fan-Out Semiconductor Package

Application: 16/008,810 →

Publication: US 2019/0164933

Antenna Module

Patent: 10,741,509 →

Application: 16/009,732 →

Publication: US 2019/0279950

Fan-Out Semiconductor Package

Patent: 10,541,221 →

Application: 16/010,754 →

Publication: US 2019/0164926

Fan-Out Semiconductor Package

Application: 16/012,037 →

Publication: US 2019/0198429

Semiconductor Package

Patent: 10,833,040 →

Application: 16/015,815 →

Publication: US 2019/0189583

Fan-Out Semiconductor Package

Patent: 10,515,916 →

Application: 16/025,267 →

Publication: US 2018/0308815

Fan-Out Semiconductor Package

Patent: 10,522,451 →

Application: 16/035,192 →

Publication: US 2018/0342449

Fan-Out Semiconductor Package

Patent: 10,741,461 →

Application: 16/036,209 →

Publication: US 2018/0323119

Fan-Out Sensor Package and Optical-Type Fingerprint Sensor Module Including the Same

Patent: 10,629,641 →

Application: 16/037,629 →

Publication: US 2019/0123082

Fan-Out Semiconductor Package

Patent: 10,418,317 →

Application: 16/037,670 →

Publication: US 2019/0131232

Fan-Out Semiconductor Package

Patent: 10,699,996 →

Application: 16/037,724 →

Publication: US 2019/0189550

Fan-Out Semiconductor Package and Electronic Device Including the Same

Patent: 10,446,481 →

Application: 16/038,956 →

Publication: US 2018/0342452

Fan-Out Semiconductor Package

Patent: 10,714,440 →

Application: 16/042,644 →

Publication: US 2018/0331054

Fan-Out Semiconductor Package

Patent: 10,504,836 →

Application: 16/053,193 →

Publication: US 2019/0252311

Cleaning Composition and Cleaning Method of Electronic Component Using the Same

Application: 16/053,257 →

Publication: US 2019/0203160

Fan-Out Semiconductor Package

Patent: 10,643,919 →

Application: 16/057,023 →

Publication: US 2019/0139853

Photoresist Developer Composition and Manufacturing Method of Semiconductor Package Using the Same

Patent: 10,908,505 →

Application: 16/101,883 →

Publication: US 2019/0204746

Fan-Out Semiconductor Package

Patent: 10,748,856 →

Application: 16/103,199 →

Publication: US 2019/0287924

Semiconductor Package

Patent: 10,741,510 →

Application: 16/105,227 →

Publication: US 2019/0229078

Semiconductor Package

Patent: 10,573,589 →

Application: 16/105,289 →

Publication: US 2019/0244885

Fan-Out Semiconductor Package

Patent: 10,923,433 →

Application: 16/105,942 →

Publication: US 2019/0341353

Fan-Out Semiconductor Package

Application: 16/105,956 →

Publication: US 2019/0229070

Fan-Out Semiconductor Package Module

Patent: 10,833,070 →

Application: 16/107,302 →

Publication: US 2019/0273079

Fan-Out Sensor Package

Application: 16/107,727 →

Publication: US 2019/0229055

Semiconductor Package Providing Protection from Electrical Noise

Patent: 10,672,727 →

Application: 16/108,202 →

Publication: US 2019/0206813

Semiconductor Package

Patent: 10,607,914 →

Application: 16/110,436 →

Publication: US 2019/0273030

Electronic Component Package

Patent: 10,734,335 →

Application: 16/111,713 →

Publication: US 2018/0366426

Antenna Module

Patent: 10,985,451 →

Application: 16/112,432 →

Publication: US 2019/0280374

Fan-Out Component Package

Application: 16/119,913 →

Publication: US 2019/0287938

Semiconductor Package

Application: 16/120,131 →

Publication: US 2019/0206756

Fan-Out Sensor Package

Patent: 10,700,110 →

Application: 16/132,757 →

Publication: US 2019/0229139

Fan-Out Semiconductor Package

Application: 16/132,957 →

Publication: US 2019/0229047

Semiconductor Package Integrating Active and Passive Components with Electromagnetic Shielding

Patent: 10,825,775 →

Application: 16/149,102 →

Publication: US 2019/0371731

Fan-Out Semiconductor Package

Patent: 10,580,759 →

Application: 16/152,237 →

Publication: US 2019/0267351

Carrier Substrate and Method of Manufacturing Semiconductor Package Using the Same

Patent: 10,828,871 →

Application: 16/157,701 →

Publication: US 2019/0366690

Electromagnetic Interference Shielding Structure and Semiconductor Package Including the Same

Application: 16/161,797 →

Publication: US 2019/0371737

Semiconductor Package

Application: 16/169,656 →

Publication: US 2019/0378775

Semiconductor Package

Patent: 10,727,212 →

Application: 16/170,469 →

Publication: US 2019/0287953

Semiconductor Package

Patent: 10,692,805 →

Application: 16/171,047 →

Publication: US 2019/0206783

Semiconductor Package

Patent: 10,504,855 →

Application: 16/171,126 →

Publication: US 2019/0341354

Electronic Component Package with Electromagnetic Wave Shielding

Patent: 10,692,791 →

Application: 16/178,224 →

Publication: US 2019/0371692

Semiconductor Package

Patent: 10,559,541 →

Application: 16/181,011 →

Publication: US 2019/0393168

Fan-Out Semiconductor Package

Application: 16/189,025 →

Publication: US 2019/0333837

Fan-Out Semiconductor Package

Patent: 10,770,403 →

Application: 16/197,764 →

Publication: US 2019/0341355

Semiconductor Package

Patent: 10,796,997 →

Application: 16/205,164 →

Publication: US 2020/0066639

Semiconductor Package and Board for Mounting the Same

Patent: 10,790,239 →

Application: 16/207,053 →

Publication: US 2020/0083176

Fan-Out Semiconductor Package

Patent: 11,043,441 →

Application: 16/211,928 →

Publication: US 2020/0066613

Semiconductor Package

Patent: 10,872,863 →

Application: 16/216,946 →

Publication: US 2020/0075492

Composite Antenna Substrate and Semiconductor Package Module

Patent: 10,475,756 →

Application: 16/218,203 →

Publication: US 2019/0115310

Semiconductor Package

Patent: 10,643,956 →

Application: 16/261,609 →

Publication: US 2020/0013727

Fan-Out Semiconductor Package

Patent: 10,665,549 →

Application: 16/268,874 →

Publication: US 2020/0051918

Semiconductor Package and Antenna Module Including the Same

Patent: 10,896,884 →

Application: 16/281,819 →

Publication: US 2020/0066662

Antenna Module

Patent: 10,950,561 →

Application: 16/282,631 →

Publication: US 2020/0091095

Semiconductor Package and Antenna Module Including the Same

Patent: 10,763,217 →

Application: 16/282,638 →

Publication: US 2020/0035607

Fan-Out Semiconductor Package

Patent: 10,748,833 →

Application: 16/282,642 →

Publication: US 2020/0083137

Semiconductor Package

Patent: 10,770,416 →

Application: 16/282,980 →

Publication: US 2020/0075517

Fan-Out Semiconductor Package

Patent: 10,685,916 →

Application: 16/285,596 →

Publication: US 2020/0075487

Semiconductor Package

Patent: 11,075,175 →

Application: 16/285,606 →

Publication: US 2020/0051933

Antenna Module

Patent: 10,938,090 →

Application: 16/287,056 →

Publication: US 2020/0014090

Semiconductor Package

Patent: 10,811,379 →

Application: 16/287,064 →

Publication: US 2020/0013743

Semiconductor Package with Improved Power Integrity

Patent: 10,854,585 →

Application: 16/287,372 →

Publication: US 2020/0027864

Semiconductor Package Mounted Substrate

Patent: 11,201,108 →

Application: 16/291,060 →

Publication: US 2020/0035589

Antenna Module

Patent: 11,177,551 →

Application: 16/291,594 →

Publication: US 2020/0028239

Fan-Out Semiconductor Package

Patent: 10,790,255 →

Application: 16/291,621 →

Publication: US 2020/0105703

Electronic Component Package

Application: 16/293,221 →

Publication: US 2020/0027833

Semiconductor Package

Patent: 11,380,636 →

Application: 16/293,239 →

Publication: US 2020/0083184

Semiconductor Package

Patent: 10,756,030 →

Application: 16/293,301 →

Publication: US 2020/0051928

Semiconductor Package

Patent: 11,011,485 →

Application: 16/294,083 →

Publication: US 2020/0091099

Fan-Out Semiconductor Package

Patent: 10,886,246 →

Application: 16/351,784 →

Publication: US 2020/0035632

Resin Composition for Printed Circuit Board and Integrated Circuit Package, and Product Using the Same

Application: 16/353,184 →

Publication: US 2019/0345323

Resin Composition for Printed Circuit Board and Integrated Circuit Package, and Product Using the Same

Application: 16/354,931 →

Publication: US 2019/0345325

Semiconductor Package

Patent: 10,741,498 →

Application: 16/357,783 →

Publication: US 2020/0020638

Semiconductor Package Having Mark with Identification Information

Patent: 10,825,778 →

Application: 16/371,653 →

Publication: US 2020/0105679

Electronic Component Package and Manufacturing Method of the Same

Patent: 10,636,743 →

Application: 16/375,302 →

Publication: US 2019/0229060

Semiconductor Package Including Plurality of Semiconductor Chips on Common Connection Structure

Patent: 11,164,838 →

Application: 16/388,004 →

Publication: US 2020/0266167

Low-Loss Insulating Resin Composition and Insulating Film Using the Same

Application: 16/392,858 →

Publication: US 2019/0345326

Semiconductor Package

Patent: 11,127,692 →

Application: 16/393,073 →

Publication: US 2020/0168562

Carrier Substrate and Method of Manufacturing Semiconductor Package Using the Same

Patent: 10,790,224 →

Application: 16/399,540 →

Publication: US 2019/0259697

Semiconductor Package and Electromagnetic Interference Shielding Structure for the Same

Patent: 10,847,474 →

Application: 16/403,968 →

Publication: US 2020/0152580

Semiconductor Package

Patent: 10,811,352 →

Application: 16/405,693 →

Publication: US 2020/0105665

Semiconductor Package

Patent: 10,847,476 →

Application: 16/406,951 →

Publication: US 2020/0168565

Semiconductor Package

Patent: 10,872,860 →

Application: 16/407,561 →

Publication: US 2020/0144183

Antenna Module

Patent: 10,903,548 →

Application: 16/410,853 →

Publication: US 2020/0185815

Package on Package and Package Connection System Comprising the Same

Patent: 10,930,593 →

Application: 16/413,039 →

Publication: US 2020/0294917

Semiconductor Package

Patent: 10,818,604 →

Application: 16/414,016 →

Publication: US 2020/0303314

Semiconductor Package

Patent: 11,043,449 →

Application: 16/418,861 →

Publication: US 2020/0168544

Open Pad Structure and Semiconductor Package Comprising the Same

Application: 16/418,865 →

Publication: US 2020/0105694

Semiconductor Package

Patent: 11,075,193 →

Application: 16/418,885 →

Publication: US 2020/0144235

Related Assignments (19)

Other recorded transfers of the patents in this record — the chain of ownership.

Assignment of Assignor's Interest Mar 21, 2016

From: LEE, DOO HWAN; KIM, HYOUNG JOON; KIM, JONG RIP; OH, KYUNG SEOB

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 038054/0470 →

Assignment of Assignor's Interest Apr 28, 2016

From: KANG, SEUNG ON; HAN, WOO SUNG; KO, YOUNG GWAN; KIM, CHUL KYU

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 038405/0806 →

Assignment of Assignor's Interest May 2, 2016

From: PARK, DAE HYUN; KIM, HAN; HUR, KANG HEON; KO, YOUNG GWAN

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 038437/0090 →

Assignment of Assignor's Interest May 11, 2016

From: JEONG, SUNG WON; KO, YOUNG GWAN; KANG, MYUNG SAM; MIN, TAE HONG

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 038549/0390 →

Assignment of Assignor's Interest Jun 14, 2016

From: OH, KYUNG SEOB; KIM, YOUNG MIN

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 038912/0661 →

Assignment of Assignor's Interest Jun 15, 2016

From: LEE, JI HYUN; JEONG, SUNG WON; AHN, HA YOUNG; SEO, SHANG HOON

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 038922/0154 →

Assignment of Assignor's Interest Jun 24, 2016

From: HARR, KYOUNG MOO; KIM, JI HOON; OH, KYUNG SEOB; KIM, SUN HO

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 039164/0068 →

Assignment of Assignor's Interest Jul 1, 2016

From: BAEK, YONG HO; CHO, JUNG HYUN; CHOI, JAE HOON

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 039066/0717 →

Assignment of Assignor's Interest Jul 5, 2016

From: KO, YOUNG GWAN; JEONG, SUNG WON

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 039256/0344 →

Assignment of Assignor's Interest Jul 6, 2016

From: KIM, HAN; KO, YOUNG GWAN; HUR, KANG HEON; JUNG, KYUNG MOON

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 039086/0856 →

Assignment of Assignor's Interest Jul 8, 2016

From: JEONG, SUNG WON; KIM, JI HOON; KIM, SUN HO; SEO, SHANG HOON

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 039109/0556 →

Assignment of Assignor's Interest Sep 28, 2016

From: LEE, SANG MIN

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 039879/0716 →

Assignment of Assignor's Interest Sep 28, 2016

From: KIM, HAN; HAN, MI JA; HUR, KANG HEON; KO, YOUNG GWAN

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 040168/0300 →

Assignment of Assignor's Interest Oct 5, 2016

From: LEE, DOO HWAN; OH, KYUNG SEOB; KIM, JONG RIP; KIM, HYOUNG JOON

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 040239/0877 →

Assignment of Assignor's Interest Oct 19, 2016

From: PARK, DAE HYUN; KIM, HAN; HUR, KANG HEON; KO, YOUNG GWAN

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 040066/0643 →

Assignment of Assignor's Interest Oct 26, 2016

From: KIM, YOON SU; BAEK, SEUNG MIN; KO, YOUNG GWAN

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 040496/0917 →

Assignment of Assignor's Interest Oct 27, 2016

From: KIM, SUN HO; KIM, JI HOON; AHN, HA YOUNG; SEO, SHANG HOON

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 040562/0339 →

Assignment of Assignor's Interest Jun 15, 2018

From: KIM, DOO IL; JUNG, DAE KWON; HUR, YOUNG SIK; BAEK, YONG HO

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 046103/0713 →

Assignment of Assignor's Interest Jun 18, 2018

From: SEOL, YONG JIN; KANG, MYUNG SAM; KO, YOUNG GWAN

To: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Reel/Frame 046118/0716 →