Patent Assignment
Reel/Frame 040066/0643
Assignment of Assignor's Interest
Recorded: 2016-10-19
Pages: 5
Assignors
PARK, DAE HYUN
Executed: 2016-10-13
KIM, HAN
Executed: 2016-10-13
HUR, KANG HEON
Executed: 2016-10-13
KO, YOUNG GWAN
Executed: 2016-10-13
SHIM, JUNG HO
Executed: 2016-10-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.