Composite antenna substrate and semiconductor package module
A composite antenna substrate and semiconductor package module includes: a fan-out semiconductor package including a semiconductor chip, an encapsulant encapsulating at least portions of the semiconductor chip, and a connection member including a redistribution layer electrically connected to connection pads; and an antenna substrate including an antenna member including antenna patterns, ground patterns, and feed lines, and a wiring member disposed below the antenna member and including wiring layers including feeding patterns electrically connected to the feed lines.
1. A composite antenna substrate and semiconductor package module comprising:
a fan-out semiconductor package including:
a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface,
an encapsulant encapsulating at least portions of the semiconductor chip, and
a connection member disposed on the semiconductor chip and including a redistribution layer electrically connected to the connection pads; and
an antenna substrate including:
an antenna member and a wiring member disposed below the antenna member,
the antenna member including an insulating layer, a first pattern layer disposed on a first surface of the insulating layer and including antenna patterns, a second pattern layer disposed on a second surface opposite the first surface of the insulating layer and including ground patterns, and vias penetrating through the insulating layer and including feed lines electrically connected to the antenna patterns, and
the wiring member including wiring layers including feeding patterns electrically connected to the feed lines,
wherein the fan-out semiconductor package and the antenna substrate are coupled to each other so that the connection member and the wiring member face each other.
2. The composite antenna substrate and semiconductor package module of claim 1 , wherein the semiconductor chip includes a radio frequency integrated circuit (RFIC).
3. The composite antenna substrate and semiconductor package module of claim 1 , wherein the antenna pattern includes at least one of a dipole antenna and a patch antenna.
4. The composite antenna substrate and semiconductor package module of claim 3 , wherein the patch antenna and the feed line connected to the patch antenna are surrounded by ground vias penetrating through the insulating layer of the antenna member.
5. The composite antenna substrate and semiconductor package module of claim 1 , wherein the semiconductor chip is disposed in face-up form so that the active surface is directed toward the wiring member.
6. The composite antenna substrate and semiconductor package module of claim 1 , wherein the wiring layer of the wiring member includes filter patterns electrically connected to the feed lines.
7. The composite antenna substrate and semiconductor package module of claim 1 , wherein the antenna substrate is integrated with the fan-out semiconductor package.
8. The composite antenna substrate and semiconductor package module of claim 7 , wherein the connection member and the wiring member are in contact and are integrated with each other.
9. The composite antenna substrate and semiconductor package module of claim 8 , wherein the redistribution layer of the connection member and the wiring layer of the wiring member are electrically connected to each other through vias of the wiring member.
10. The composite antenna substrate and semiconductor package module of claim 7 , wherein the connection member is unified in the wiring member.
11. The composite antenna substrate and semiconductor package module of claim 10 , wherein the fan-out semiconductor package further includes through-vias penetrating through the encapsulant and electrically connected to the wiring layer of the wiring member.
12. The composite antenna substrate and semiconductor package module of claim 10 , wherein the semiconductor chip is disposed on the wiring member through a bump.
13. The composite antenna substrate and semiconductor package module of claim 10 , wherein the semiconductor chip is disposed in face-down form so that the inactive surface is directed toward the wiring member, and
the inactive surface of the semiconductor chip is attached to the wiring member through a die attachment film.
14. The composite antenna substrate and semiconductor package module of claim 1 , wherein the antenna substrate is disposed on the fan-out semiconductor package, and
the antenna substrate and the fan-out semiconductor package are connected to each other through electrical connection structures.
15. The composite antenna substrate and semiconductor package module of claim 1 , wherein the fan-out semiconductor package further includes a core member having a through-hole,
the semiconductor chip is disposed in the core member, and
the core member includes at least one core wiring layer electrically connected to the connection pads.
16. The composite antenna substrate and semiconductor package module of claim 15 , wherein the fan-out semiconductor package further includes a passive component disposed adjacent to the semiconductor chip in the through-hole and electrically connected to the connection pads through the redistribution layer of the connection member.
17. The composite antenna substrate and semiconductor package module of claim 15 , wherein the core wiring layer of the core member includes filter patterns electrically connected to the feed lines.
18. The composite antenna substrate and semiconductor package module of claim 15 , wherein the core member includes
a first dielectric layer in contact with the connection member,
a first core wiring layer in contact with the connection member and embedded in the first dielectric layer,
a second core wiring layer disposed on a first surface of the first dielectric layer opposing a second surface of the first dielectric layer on which the first core wiring layer is disposed, and
first core vias penetrating through the first dielectric layer and electrically connecting the first and second core wiring layers to each other, and
the first and second core wiring layers are electrically connected to the connection pads.
19. The composite antenna substrate and semiconductor package module of claim 18 , wherein the core member further includes
a second dielectric layer disposed on the first dielectric layer and covering the second core wiring layer,
a third core wiring layer disposed on a first surface of the second dielectric layer opposing a second surface of the second dielectric layer on which the second core wiring layer is disposed, and
second core vias penetrating through the second dielectric layer and electrically connecting the second and third core wiring layers to each other, and
the third core wiring layer is electrically connected to the connection pads.
20. The composite antenna substrate and semiconductor package module of claim 15 , wherein the core member includes
a first dielectric layer,
first and second core wiring layers disposed on opposite surfaces of the first dielectric layer, respectively, and
first core vias penetrating through the first dielectric layer and electrically connecting the first and second core wiring layers to each other, and
the first and second core wiring layers are electrically connected to the connection pads.
21. The composite antenna substrate and semiconductor package module of claim 20 , wherein the core member further includes
a second dielectric layer disposed on the first dielectric layer and covering the first core wiring layer,
a third dielectric layer disposed on the first dielectric layer and covering the second core wiring layer,
a third core wiring layer disposed on the second dielectric layer,
a fourth core wiring layer disposed on the third dielectric layer,
second core vias penetrating through the second dielectric layer and electrically connecting the first and third core wiring layers to each other, and
third core vias penetrating through the third dielectric layer and electrically connecting the second and fourth core wiring layers to each other, and
the third and fourth core wiring layers are electrically connected to the connection pads.
22. A composite antenna substrate and semiconductor package module comprising:
a fan-out semiconductor package including:
a core member having a through-hole,
a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface,
an encapsulant encapsulating at least portions of the semiconductor chip, and
a connection member disposed on the semiconductor chip, the core member including a core wiring layer and the connection member including a redistribution layer electrically connected to the connection pads; and
an antenna substrate including:
an antenna member in which a first pattern layer including antenna patterns is disposed on an insulating layer, a second pattern layer including ground patterns is disposed below the insulating layer, and vias penetrating through the insulating layer and including feed lines electrically connected to the antenna patterns are formed in the insulating layer, and
a wiring member disposed below the antenna member and including wiring layers including feeding patterns electrically connected to the feed lines,
wherein the antenna substrate is disposed on the fan-out semiconductor package, and
the antenna substrate and the fan-out semiconductor package are connected to each other through electrical connection structures.
23. The composite antenna substrate and semiconductor package module of claim 22 , wherein the fan-out semiconductor package further includes:
a first metal layer disposed on a wall surface of the through-hole and extending to at least a surface of the core member, a second metal layer disposed on the encapsulant to cover the inactive surface of the semiconductor chip; and
a metal via connecting the first metal layer and the second metal layer to each other, while penetrating through the encapsulant.
24. The composite antenna substrate and semiconductor package module of claim 23 , wherein the fan-out semiconductor package further includes:
a passivation layer disposed on the encapsulant and having an opening exposing at least a portion of the second metal layer; and
a second electrical connection structure disposed on the opening of the passivation layer, while being connected to the second metal layer having the at least a portion exposed by the opening.
25. The composite antenna substrate and semiconductor package module of claim 23 , wherein the first metal layer and the second metal layer comprise a ground pattern.