Electronic component package and method of manufacturing the same
An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.
1. An electronic component package comprising:
first and second wiring parts each including an insulating layer, conductive patterns formed in the insulating layer, and a conductive via penetrating through the insulating layer, to be connected to the conductive patterns;
a frame disposed between the first and second wiring parts and having one or more through-holes and conductive connection parts electrically connecting the first wiring part with the second wiring part; and
an electronic component disposed in the through-hole, and connected to the first wiring part,
wherein the first wiring part includes conductive patterns adjacent to the electronic component among the conductive patterns of the first wiring part, and the conductive patterns adjacent to the electronic component are embedded in the insulating layer of the first wiring part, and
the conductive patterns of the first wiring part adjacent to the electronic component have a smaller pitch than those which are not adjacent to the electronic component.
2. The electronic component package of claim 1 , further comprising an encapsulant disposed in the through-hole.
3. The electronic component package of claim 1 , wherein the electronic component is disposed such that an electrode pad included in the electronic component is directed toward the first wiring part.
4. The electronic component package of claim 1 , wherein the frame is formed of a prepreg, and
the first and second wiring parts include a photo curable material.
5. The electronic component package of claim 1 , wherein the first wiring part is thicker than the second wiring part.
6. An electronic component package comprising:
first and second wiring parts each including an insulating layer, conductive patterns formed in the insulating layer, and a conductive via penetrating through the insulating layer, to be connected to the conductive patterns;
a frame disposed between the first and second wiring parts and having one or more through-holes and conductive connection parts electrically connecting the first wiring part with the second wiring part;
an electronic component disposed in the through-hole, and connected to the first wiring part, and
an adhesive layer interposed between the first wiring part and the frame,
wherein the first wiring part includes conductive patterns adjacent to the electronic component among the conductive patterns of the first wiring part, and the conductive patterns adjacent to the electronic component are embedded in the insulating layer of the first wiring part.
7. The electronic component package of claim 6 , wherein the adhesive layer is a prepreg or a solder resist.
8. The electronic component package of claim 6 , wherein the conductive connection part penetrates through the frame, and has a shape in which a width is decreased from upper and lower surfaces of the frame to an inside of the frame.
9. An electronic component package comprising:
first and second wiring parts each including an insulating layer, conductive patterns formed in the insulating layer, and a conductive via penetrating through the insulating layer, to be connected to the conductive patterns;
a frame disposed between the first and second wiring parts and having one or more through-holes and conductive connection parts electrically connecting the first wiring part with the second wiring part;
an electronic component disposed in the through-hole, and connected to the first wiring part; and
an etch stop layer formed between the first wiring part and the frame, and in a region around the through-hole,
wherein the etch stop layer is made of a metal.
10. The electronic component package of claim 9 , wherein the etch stop layer is electrically isolated from the electronic component.
11. The electronic component package of claim 9 , wherein the frame has a multilayer structure.
12. The electronic component package of claim 11 , wherein the conductive connection part penetrates through each of the layers of the frame having the multilayer structure, and
the conductive connection part of each of the layers has a shape in which a width is decreased from an upper portion of the conductive connection part to a lower portion thereof.
13. The electronic component package of claim 1 , further comprising an additional electronic component embedded in the first wiring part.
14. The electronic component package of claim 13 , wherein the electronic component is an active element, and
the additional electronic component is a passive element.
15. An electronic component package comprising:
first and second wiring parts each including an insulating layer, conductive patterns formed in the insulating layer, and a conductive via penetrating through the insulating layer, to be connected to the conductive patterns;
a frame disposed between the first and second wiring parts and having one or more through-holes and conductive connection parts electrically connecting the first wiring part with the second wiring part;
an electronic component disposed in the through-hole, and connected to the first wiring part; and
an etch stop layer formed between the first wiring part and the frame, and in a region around the through-hole,
wherein the etch stop layer is partially embedded in the frame.