Electronic component package and method of manufacturing the same
An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.
1. An electronic component package comprising:
a frame having a cavity;
an electronic component disposed in the cavity of the frame;
a first metal layer disposed on an inner wall of the cavity of the frame;
a second metal layer disposed on a lower surface of the frame;
a third metal layer disposed on an upper surface of the frame;
a penetration wiring penetrating through the frame;
an encapsulant encapsulating at least portion of the electronic component; and
a redistribution layer disposed below the frame and the electronic component, wherein the second and third metal layers are redistribution patterns or dummy patterns.
2. The electronic component package of claim 1 , wherein the first metal layer encloses around side surfaces of the electronic component.
3. The electronic component package of claim 2 , wherein the first metal layer entirely covers the inner wall of the cavity of the frame.
4. The electronic component package of claim 1 , wherein the second metal layer is connected to the first metal layer.
5. The electronic component package of claim 1 , wherein the second metal layer entirely covers the lower surface of the frame.
6. The electronic component package of claim 1 , wherein the third metal layer is connected to the first metal layer.
7. The electronic component package of claim 1 , wherein the third metal layer entirely covers the upper surface of the frame.
8. The electronic component package of claim 1 , further comprising:
an external layer disposed below the redistribution layer and having an opening; and
an external connection terminal disposed in the opening,
wherein at least one external connection terminal is disposed in a fan-out region.
9. The electronic component package of claim 1 , wherein the encapsulant fills a space in the cavity of the frame while covering upper portions of the frame and the electronic component.
10. The electronic component package of claim 9 , wherein the encapsulant encloses outer side surfaces of the frame, and the frame is not externally exposed.
11. A method of manufacturing an electronic component package, the method comprising:
preparing a frame having a cavity;
forming a first metal layer on an inner wall of the cavity of the frame;
forming a second metal layer on a lower surface of the frame;
forming a third metal layer on an upper surface of the frame;
forming a penetration wiring penetrating through the frame;
disposing an electronic component in the cavity of the frame;
forming an encapsulant encapsulating at least portion of the electronic component; and
forming a redistribution layer below the frame and the electronic component, wherein the second and third metal layers are redistribution patterns or dummy patterns.
12. The method of claim 11 ,
wherein the first to third metal layers are simultaneously formed.