Composite antenna substrate and semiconductor package module

1. A composite antenna substrate and semiconductor package module comprising:

an antenna substrate including:

a first pattern layer including a first ground pattern and a first antenna pattern,

a second pattern layer disposed on a level lower than a level of the first pattern layer and including a second ground pattern and a second antenna pattern, and

a third pattern layer formed of one or more layers, disposed on a level lower than a level of the second pattern layer and including a wiring layer and a feeding pattern, wherein the feeding pattern is electrically connected to the second antenna pattern; and

a fan-out semiconductor package including:

a semiconductor chip having a first surface having connection pads disposed thereon and a second surface opposing the first surface, an encapsulant encapsulating at least portions of the semiconductor chip, and

a connection member disposed on the first surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads,

wherein the antenna substrate is stacked on the fan-out semiconductor package to be connected to the fan-out semiconductor package through a first electrical connection structure.

2. The composite antenna substrate and semiconductor package of claim 1 , wherein the semiconductor chip is disposed in face-up form, in such a manner that the first surface faces the antenna substrate, and

at least one of the connection pads is electrically connected to the feeding pattern.

3. The composite antenna substrate and semiconductor package module of claim 1 , wherein the fan-out semiconductor package further includes one or more passive components disposed around the semiconductor chip on the connection member, and the one or more passive components are respectively, electrically connected to the connection pad through at least one of the redistribution layer and the wiring layer of the third pattern layer.

4. The composite antenna substrate and semiconductor package module of claim 3 , wherein the one or more passive components comprise at least one of an inductor and a capacitor.

5. The composite antenna substrate and semiconductor package module of claim 1 , wherein the fan-out semiconductor package further includes a member having a through-hole,

the semiconductor chip is disposed in the through hole, and

the member includes a plurality of wiring layers electrically connected to the connection pads.

6. The composite antenna substrate and semiconductor package module of claim 5 , wherein the fan-out semiconductor package further includes a first metal layer disposed on a side wall of the through hole.

7. The composite antenna substrate and semiconductor package module of claim 6 , wherein the fan-out semiconductor package further includes a second metal layer disposed on a side of the encapsulant opposite to a side on which the connection member is disposed.

8. The composite antenna substrate and semiconductor package module of claim 7 , wherein the first metal layer is disposed to extend to at least one surface of the member,

the fan-out semiconductor package further includes a first metal via penetrating through the encapsulant to connect the first metal layer and the second metal layer to each other.

9. The composite antenna substrate and semiconductor package module of claim 7 , wherein the fan-out semiconductor package further includes a second metal via penetrating through the encapsulant to connect the second surface of the semiconductor chip and the second metal layer to each other.

10. The composite antenna substrate and semiconductor package module of claim 7 , wherein the fan-out semiconductor package further includes a backside wiring layer disposed on the side of the encapsulant opposite to the side on which the connection member is disposed, and a backside via penetrating through the encapsulant to electrically connect the backside wiring layer to the plurality of wiring layers.

11. The composite antenna substrate and semiconductor package module of claim 10 , wherein the backside wiring layer is located on the same level as the second metal layer.

12. The composite antenna substrate and semiconductor package module of claim 11 , wherein the fan-out semiconductor package further includes:

a passivation layer disposed on the side of the encapsulant opposite to the side on which the connection member is disposed, to cover the second metal layer and the backside wiring layer, the passivation layer having an opening exposing at least a portion of each of the second metal layer and the backside wiring layer.

13. The composite antenna substrate and semiconductor package module of claim 12 , wherein the fan-out semiconductor package further includes a second electrical connection structure disposed on the opening of the passivation layer and connected to each of the second metal layer and the backside wiring layer, of which the at least portions are exposed by the opening.

14. The composite antenna substrate and semiconductor package module of claim 5 , wherein the member comprises a first insulating layer, and a first wiring layer and a second wiring layer disposed on both surfaces of the first insulating layer, and the plurality of wiring layers comprise the first wiring layer and the second wiring layer.

15. The composite antenna substrate and semiconductor package module of claim 14 , wherein the member further comprises:

a second insulating layer and a third insulating layer disposed on both surfaces of the first insulating layer to cover the first wiring layer and the second wiring layer, respectively;

a third wiring layer disposed on a side of the second insulating layer opposite to a side in which the first wiring layer is embedded; and

a fourth wiring layer disposed on a side of the third insulating layer opposite to a side in which the second wiring layer is embedded, and

the plurality of wiring layers comprise the first to fourth wiring layers.

16. The composite antenna substrate and semiconductor package module of claim 5 , wherein the member comprises a first insulating layer, a first wiring layer embedded in the first insulating layer and in contact with the connecting member, a second wiring layer disposed on a side of the first insulating layer opposite to a side in which the first wiring layer is embedded, a second insulating layer disposed on the side of the first insulating layer opposite to the side in which the first wiring layer is embedded and covering the second wiring layer, and a third wiring layer disposed on a side of the second insulating layer opposite to a side in which the second wiring layer is embedded, and

the plurality of wiring layers comprise the first to third wiring layers.