Patent Assignment
Reel/Frame 047759/0342
Assignment of Assignor's Interest
Recorded: 2018-12-12
Pages: 5
Assignors
BAEK, YONG HO
Executed: 2018-03-22
KIM, DOO IL
Executed: 2018-03-22
HUR, YOUNG SIK
Executed: 2018-03-22
CHO, JUNG HYUN
Executed: 2018-03-22
SO, WON WOOK
Executed: 2018-03-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Composite Antenna Substrate and Semiconductor Package Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.