Electronic component package and package-on-package structure including the same
An electronic component package includes a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in the through-hole, an insulating part at least covering upper portions of the frame and the electronic component, a bonding part at least partially disposed between the frame and the insulating part, and a redistribution part disposed at one side of the frame and the electronic component.
1. An electronic component package comprising:
a frame containing a metal or ceramic based material and having a through-hole;
an electronic component disposed in the through-hole;
an insulating part at least covering upper portions of the frame and the electronic component;
an electrically conductive bonding part disposed on the frame and at least partially separating the insulating part from the frame; and
a redistribution part disposed below the frame and the electronic component,
wherein a lower surface of the electrically conductive bonding part is substantially coplanar with a lower surface of the insulating part and a lower surface of the electronic component facing the redistribution part.
2. The electronic component package of claim 1 , wherein the metal based material is an Fe—Ni based alloy (Invar).
3. The electronic component package of claim 1 , wherein the ceramic based material is at least one selected from the group consisting of a zirconia based (ZrO 2 ) material, an alumina based (Al 2 O 3 ) material, a silicon carbide based (SiC) material, and a silicon nitride based (Si 3 N 4 ) material.
4. The electronic component package of claim 1 , wherein the metal or ceramic based material has thermal conductivity of 1 W/mK or more, a coefficient of thermal expansion (CTE) of 10 ppm/° C. or less, and an elastic modulus of 100 GPa or more.
5. The electronic component package of claim 1 , wherein the frame includes any layer that is penetrated through by the through-hole in which the electronic component is disposed, and
any layer of the frame has a thermal conductivity of 1 W/mK or more, a coefficient of thermal expansion (CTE) of 10 ppm/° C. or less, and an elastic modulus of 100 GPa or more.
6. The electronic component package of claim 1 , wherein the electrically conductive bonding part has a thermal conductivity greater than that of the metal or ceramic based material contained in the frame.
7. The electronic component package of claim 1 , further comprising a through-wiring penetrating through the frame,
wherein an insulating material is disposed between the electrically conductive bonding part and the through-wiring.
8. The electronic component package of claim 1 , wherein the insulating part encloses outer side portions of the frame, and
the frame is not externally exposed.
9. The electronic component package of claim 1 , wherein the frame includes one or more heat dissipation layers including a conductive material disposed therein, and
the metal or ceramic based material is divided into a plurality of layers by the one or more the heat dissipation layers.
10. The electronic component package of claim 9 , wherein the one or more heat dissipation layers have a thermal conductivity greater than that of the remaining portion of the frame.
11. The electronic component package of claim 1 , further comprising:
an outer layer disposed below the redistribution part and having first opening parts; and
first external connection terminals disposed in the first opening parts,
wherein at least one of the first external connection terminals is disposed in a fan-out region.
12. The electronic component package of claim 1 , further comprising:
a cover layer disposed above the insulating part and having second opening parts; and
second external connection terminals disposed in the second opening parts,
wherein the second external connection terminals are electrically connected to the electronic component.
13. The electronic component package of claim 1 , wherein the electrically conductive bonding part extends between the frame and the redistribution part and completely separates the frame and the redistribution part from each other.
14. The electronic component package of claim 1 , wherein the electrically conductive bonding part completely separates the frame and the insulating part from each other.
15. The electronic component package of claim 1 , wherein the electrically conductive bonding part extends to and is disposed on an inner wall of the through-hole.
16. The electronic component package of claim 1 , wherein the electrically conductive bonding part includes a first bonding part and a second bonding part,
the first bonding part is disposed on a lower surface of the frame and an upper surface thereof opposing the lower surface, and
the second bonding part is disposed on the first bonding part and extends to an inner wall of the through-hole.
17. The electronic component package of claim 1 , wherein an inner wall of the through-hole is not covered by the electrically conductive bonding part.
18. The electronic component package of claim 1 , wherein the redistribution part includes an insulating layer and conductive patterns disposed on the insulating layer,
wherein a lower surface of the frame facing the insulating layer of the redistribution part is completely covered by the electrically conductive bonding part, and
the lower surface of the electronic component, the lower surface of the insulating part, and the lower surface of the electrically conductive bonding part are in contact with the insulating layer of the redistribution part.
19. The electronic component package of claim 18 , wherein the conductive patterns of the redistribution part are electrically connected to the electrode pads of the electronic component directly through vias penetrating through the insulating layer of the redistribution part.
20. A package-on-package structure comprising:
a first electronic component package including:
a frame containing a metal or ceramic based material and having a through-hole,
an electronic component disposed in the through-hole,
an insulating part at least covering upper portions of the frame and the electronic component,
an electrically conductive bonding part disposed on the frame and at least partially separating the insulating part from the frame,
a through-wiring penetrating through the frame,
a redistribution part disposed below the frame and the electronic component,
first external connection terminals disposed below the redistribution part, and
second external connection terminals disposed above the insulating part,
wherein a lower surface of the electrically conductive bonding part is substantially coplanar with a lower surface of the insulating part and a lower surface of the electronic component facing the redistribution part; and
a second electronic component package disposed above the first electronic component package and connected to the first electronic component package through the second external connection terminals.
21. The package-on-package structure of claim 20 , further comprising a third electronic component package disposed below the first electronic component package and connected to the first electronic component package through the first external connection terminals.
22. The package-on-package structure of claim 20 , wherein the frame includes any layer that is penetrated through by the through-hole in which the electronic component is disposed, and
any layer of the frame has a thermal conductivity of 1 W/mK or more, a coefficient of thermal expansion (CTE) of 10 ppm/° C. or less, and an elastic modulus of 100 GPa or more.
23. The package-on-package structure of claim 20 , wherein the electrically conductive bonding part extends between the frame and the redistribution part and completely separates the frame and the redistribution part from each other.
24. The package-on-package structure of claim 20 , wherein the frame contains an Fe—Ni based alloy (Invar).
25. An electronic component package comprising:
a frame having a through-hole;
a bonding part disposed on at least one surface of the frame;
an electronic component disposed in the through-hole of the frame;
a redistribution part, on which the frame and the electronic component are disposed, including an insulating layer, and conductive patterns disposed on the insulating layer and electrically connected to electrode pads of the electronic component directly through vias penetrating through the insulating layer of the redistribution part; and
an insulating part at least filling a portion of a space of the through-hole confined by the redistribution part, the electronic component, and the frame,
wherein
the bonding part is electrically conductive and at least partially separates the insulating part from the frame,
a lower surface of the electronic component, on which the electrode pads of the electronic components are disposed, and a lower surface of the insulating part are in contact with the insulating layer of the redistribution part, and
a lower surface of the frame facing the insulating layer of the redistribution part is completely covered by the bonding part.
26. The electronic component package of claim 25 , wherein a material for forming the frame is a metal or ceramic based material.
27. The electronic component package of claim 25 , wherein a thickness of a portion of the bonding part on an inner wall of the through-hole is less than a thickness of another portion of the bonding part on an upper surface or the lower surface of the frame, and
the inner wall connects the upper surface and the lower surface of the frame to each other.
28. The electronic component package of claim 25 , wherein the frame contains an Fe—Ni based alloy (Invar).
29. The electronic component package of claim 25 , wherein the frame has a thermal conductivity of 1 W/mK or more, a coefficient of thermal expansion (CTE) of 10 ppm/° C. or less, and an elastic modulus of 100 GPa or more.