Patent Assignment
Reel/Frame 038549/0390
Assignment of Assignor's Interest
Recorded: 2016-05-11
Pages: 5
Assignors
JEONG, SUNG WON
Executed: 2016-05-03
KO, YOUNG GWAN
Executed: 2016-05-03
KANG, MYUNG SAM
Executed: 2016-05-02
MIN, TAE HONG
Executed: 2016-05-02
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Package and Package-on-Package Structure Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.