IP Library › Assignment 039164/0068
Patent Assignment
Reel/Frame 039164/0068

Assignment of Assignor's Interest

Recorded: 2016-06-24 Pages: 5
Assignors
HARR, KYOUNG MOO
Executed: 2016-04-20
KIM, JI HOON
Executed: 2016-04-20
OH, KYUNG SEOB
Executed: 2016-04-20
KIM, SUN HO
Executed: 2016-04-20
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Electronic Component Package and Method of Manufacturing the Same
Patent: 9,905,526 →
Application: 15/192,634 →
Publication: US 2017/0125318
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →