Patent Assignment
Reel/Frame 040168/0300
Assignment of Assignor's Interest
Recorded: 2016-09-28
Pages: 5
Assignors
KIM, HAN
Executed: 2016-09-22
HAN, MI JA
Executed: 2016-09-22
HUR, KANG HEON
Executed: 2016-09-26
KO, YOUNG GWAN
Executed: 2016-09-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package for Packaging Semiconductor Chip and Capacitors
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.