LOW-LOSS INSULATING RESIN COMPOSITION AND INSULATING FILM USING THE SAME

1 . A low-loss insulating resin composition comprising:

an epoxy resin composite comprising a cyanate ester resin, a biphenylaralkyl novolac resin, and a fluorine-containing epoxy resin;

an active ester hardener;

a thermoplastic resin;

a hardening accelerator;

a filler; and

a viscosity enhancer.

2 . The resin composition of claim 1 , wherein the epoxy resin composite comprises 40 to 60 parts by weight of the cyanate ester resin, 15 to 35 parts by weight of the biphenylaralkyl novolac epoxy resin, and 15 to 35 parts by weight of the fluorine-containing epoxy resin.

3 . The resin composition of claim 1 , wherein the hardener is contained in an amount of 0.5 to 1.5 equivalents based on a mixed equivalent of the epoxy resin composite.

4 . The resin composition of claim 1 , wherein the thermoplastic resin is contained in an amount of 5 to 15 parts by weight based on 100 parts by weight of the epoxy resin composite and the active ester hardener.

5 . The resin composition of claim 1 , wherein the thermoplastic resin is at least one of a polyvinyl acetal resin, a phenoxy resin, a polyimide resin, a polyamideimide resin, a polyetherimide resin, a polysulfone resin, a polyethersulfone resin, a polyphenylene ether resin, a polycarbonate resin, a polyetheretherketone resin, a polyester resin, a phenolic resin, a fluorine-based thermoplastic resin, and a polyacetal resin.

6 . The resin composition of claim 1 , wherein the hardening accelerator is at least one of 2-ethyl-4methylimidazole, 1-(2-cyanoethyl)-2-alkylimidazole, 2-phenylimidazole, dimethylaminopyridine (DMAP), 3,3′-thiodipropionic acid, and 4,4′-thiodiphenol.

7 . The resin composition of claim 1 , wherein the hardening accelerator is contained in an amount of 0.1 to 1 part by weight based on 100 parts by weight of the epoxy resin composite.

8 . The resin composition of claim 1 , wherein the filler is an inorganic filler, and is contained in an amount of 40 to 85 parts by weight based on 100 parts by weight of the epoxy resin composite.

9 . The resin composition of claim 8 , wherein the inorganic filler is at least one of barium titanium oxide, barium strontium titanate, titanium oxide, lead zirconium titanate, lead lanthanum zirconate titanate, lead magnesium niobate-lead titanate, silver, nickel, nickel-coated polymer sphere, gold-coated polymer sphere, tin solder, graphite, tantalum nitride, metal silicon nitride, carbon black, silica, clay, aluminum, and aluminum borate.

10 . The resin composition of claim 8 , wherein the inorganic filler is surface-treated with a silane coupling agent.

11 . The resin composition of claim 1 , wherein the viscosity enhancer is contained in an amount of 1 to 5 parts by weight based on 100 parts by weight of the low-loss insulating resin composition.

12 . The resin composition of claim 1 , wherein the viscosity enhancer is at least one of an organic viscosity enhancer and an inorganic viscosity enhancer.

13 . The resin composition of claim 1 , further comprising a surface improving agent.

14 . An insulating film comprising the low-loss insulating resin composition of claim 1 .

15 . The insulating film of claim 14 , wherein the insulating film is a mold film having a thickness of 200 μm or more.

16 . A product comprising the insulating film of claim 14 .

17 . The product of claim 16 , wherein the product is at least one of a substrate and an antenna package for a high frequency antenna module.

18 . The insulating film of claim 14 , wherein the low-loss insulating resin is cast on the insulating film.

19 . The resin composition of claim 1 , wherein the filler is an inorganic filler.