ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

1 . An electronic component package comprising:

an electronic component disposed on a wiring part;

an encapsulant encapsulating the electronic component;

a first conductive connection structure penetrating through the encapsulant to thereby be connected to the wiring part and having an upper surface disposed at a level below an upper surface of the encapsulant to form a step structure; and

a second conductive connection structure filling the step structure to thereby be connected to the first conductive connection structure.

2 . The electronic component package of claim 1 , further comprising an adhesive layer formed on an upper surface of the electronic component.

3 . The electronic component package of claim 2 , wherein an upper surface of the adhesive layer and the upper surface of the encapsulant are coplanar with each other.

4 . The electronic component package of claim 2 , further comprising an insulating external layer formed on the encapsulant and contacting the adhesive layer.

5 . The electronic component package of claim 1 , wherein the electronic component includes electrode pads formed on one surface thereof, the electrode pads being disposed in a direction toward the wiring part and electrically connected to conductive patterns of the wiring part.

6 . The electronic component package of claim 1 , wherein the wiring part includes an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via penetrating through the insulating layer to thereby be connected to the conductive pattern.

7 . The electronic component package of claim 1 , wherein the first conductive connection structure is a conductive post.

8 . The electronic component package of claim 1 , wherein the first conductive connection structure is a solder ball.

9 . The electronic component package of claim 1 , wherein the second conductive connection structure is an adhesive electrical connection material.

10 . The electronic component package of claim 9 , wherein the second conductive connection structure is a solder ball.

11 . The electronic component package of claim 1 , further comprising an additional wiring part and an additional electronic component disposed on the encapsulant.

12 . A method of manufacturing an electronic component package, comprising:

disposing a first conductive connection structure on a support;

disposing an electronic component on the support;

forming an encapsulant encapsulating the first conductive connection structure and the electronic component on the support;

forming a wiring part connected to the first conductive connection structure on the electronic component;

removing the support to expose surfaces of the encapsulant and the first conductive connection structure;

etching the exposed surface of the first conductive connection structure to form a step structure having a shape recessed from a surface of the encapsulant; and

filling a second conductive connection structure in the step structure so as to be connected to the first conductive connection structure.

13 . The method of claim 12 , wherein the disposing of the electronic component on the support includes adhering the electronic component to the support with an adhesive layer.

14 . The method of claim 12 , wherein the electronic component includes an electrode pad formed on one surface thereof, and a surface of the electronic component opposing one surface of the electronic component on which the electrode pad is formed is directed toward the support.

15 . The method of claim 12 , wherein the forming of the wiring part includes:

forming one or more insulating layers;

forming conductive vias penetrating through the insulating layers; and

forming conductive patterns on the insulating layers.

16 . The method of claim 12 , wherein the disposing of the first conductive connection structure includes forming a conductive post or a solder ball on the support.