Fan-out semiconductor package module

1. A fan-out semiconductor package module comprising:

a first connection member including a wiring layer;

a first passive component mounted on the first connection member;

a first encapsulation portion encapsulating at least a portion of the first connection member and the first passive component;

a semiconductor chip having an active surface with a connection pad disposed thereon and an inactive surface opposing the active surface, and disposed in a first through-hole penetrating through the first connection member and the first encapsulation portion;

a second encapsulation portion covering at least a portion of the semiconductor chip and encapsulating at least a portion of the first encapsulation portion and the first connection member; and

a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad and the first passive component.

2. The fan-out semiconductor package module of claim 1 , wherein the first connection member further includes a second through-hole spaced apart from the first through-hole; and

the fan-out semiconductor package module further comprises a second passive component disposed in the second through-hole.

3. The fan-out semiconductor package module of claim 2 , wherein the first passive component has a thickness less than a thickness of the second passive component.

4. The fan-out semiconductor package module of claim 2 , wherein the semiconductor chip includes a power management integrated circuit (PMIC); and

wherein each of the first and second passive components includes a capacitor.

5. The fan-out semiconductor package module of claim 1 , wherein the semiconductor chip has a thickness greater than a thickness of the first connection member.

6. The fan-out semiconductor package module of claim 1 , wherein the first connection member further includes a via electrically connecting the first passive component and the redistribution layer of the second connection member.

7. The fan-out semiconductor package module of claim 1 , further comprising a first shield layer disposed on the first encapsulation portion and the first connection member.

8. The fan-out semiconductor package module of claim 1 , further comprising a second shield layer disposed on the second encapsulation portion.

9. The fan-out semiconductor package module of claim 1 , wherein an upper surface of the second encapsulation portion is positioned above an upper surface of the first encapsulation portion.

10. The fan-out semiconductor package module of claim 1 , wherein the first passive component is adhered to the first connection member using conductive adhesives.

11. The fan-out semiconductor package module of claim 1 , wherein the semiconductor chip includes a power management integrated circuit (PMIC); and

wherein the first passive component includes a capacitor.

12. The fan-out semiconductor package module of claim 1 , wherein the first connection member includes a first insulating layer contacting the second connection member, a first wiring layer contacting the second connection member and embedded in the first insulating layer, and a second wiring layer disposed on an opposite side to a side of the first insulating layer, in which the first wiring layer is embedded; and

wherein the first and second wiring layers are electrically connected to the connection pad.

13. The fan-out semiconductor package module of claim 12 , wherein the first connection member further includes a second insulating layer disposed on the first insulating layer and covering the second wiring layer, and a third wiring layer disposed on the second insulating layer; and

wherein the third wiring layer is electrically connected to the connection pad.

14. The fan-out semiconductor package module of claim 1 , wherein the first connection member includes a first insulating layer and a first wiring layer and a second wiring layer that are disposed on opposite surfaces of the first insulating layer, and

wherein the first and second wiring layers are electrically connected to the connection pad.

15. The fan-out semiconductor package module of claim 14 , wherein the first connection member further includes a

second insulating layer disposed on the first insulating layer and covering the first wiring layer, a third wiring layer disposed on the second insulating layer, a third insulating layer disposed on the first insulating layer and covering the second wiring layer, and a fourth wiring layer disposed on the third insulating layer; and

wherein the third and fourth wiring layers are electrically connected to the connection pad.

16. The fan-out semiconductor package module of claim 1 , further comprising a third passive component,

wherein one terminal of the first passive component and one terminal of the third passive component are connected to each other by a wiring disposed on a surface of the first connection member, on which the first and third passive components are mounted.

17. A fan-out semiconductor package module comprising:

a second connection member including a redistribution layer;

a semiconductor chip disposed on a surface of the second connection member and electrically connected to the redistribution layer;

a first connection member stacked on the surface of the second connection member;

a passive component mounted on a surface of the first connection member;

a first encapsulating layer encapsulating at least a portion of the first connection member and the passive components; and

a second encapsulating layer covering at least a portion of the semiconductor chip and encapsulating at least a portion of the encapsulating layer.

18. The fan-out semiconductor package module of claim 17 , wherein the passive component is electrically connected to the redistribution layer by a via penetrating through the first connection member.

19. The fan-out semiconductor package module of claim 17 , further comprising a shield layer separating the first encapsulating layer and the second encapsulating layer.