Electronic component package
An electronic component package includes: a frame, including a through-hole and a through-wiring; an electronic component disposed in the through-hole of the frame; a metal plate disposed on a first side of the electronic component and the frame; and a redistribution layer disposed on a second side of the electronic component opposing the first side and electrically connected to the electronic component.
1. An electronic component package, comprising:
a frame having a through-hole;
an electronic component disposed in the through-hole of the frame;
an encapsulant disposed along an internal wall of the frame, and interposed between the frame and the electronic component, the encapsulant filling a first portion of the through-hole of the frame;
a second metal layer disposed along the internal wall of the frame, and interposed between the frame and the encapsulant, the second metal layer filling a second portion of the through-hole of the frame;
a third metal layer disposed directly on a lower surface of the frame;
a metal plate disposed above the electronic component and the frame;
an adhesive layer interposed between the metal plate and the electronic component, and between the metal plate and the frame; and
a redistribution layer disposed below the electronic component and the frame, and electrically connected to the electronic component.
2. The electronic component package of claim 1 , further comprising:
a first metal layer disposed on an upper surface of the frame.
3. The electronic component package of claim 1 , wherein the metal plate is electrically isolated from the electronic component.
4. The electronic component package of claim 1 , further comprising:
a through-wiring passing through the frame.
5. An electronic component package, comprising:
a frame having a through-hole;
an electronic component disposed in the through-hole of the frame;
an encapsulant disposed along an internal wall of the frame, and interposed between the frame and the electronic component, the encapsulant filling a first portion of the through-hole of the frame;
a third metal layer disposed directly on a lower surface of the frame;
a metal plate disposed above the electronic component and the frame;
an adhesive layer interposed between the metal plate and the electronic component, and between the metal plate and the frame, the adhesive layer including a first adhesive layer including a conductive epoxy; and
a redistribution layer disposed below the electronic component and the frame, and electrically connected to the electronic component.
6. An electronic component package, comprising:
a frame having a through-hole;
an electronic component disposed in the through-hole of the frame;
an encapsulant disposed along an internal wall of the frame, and interposed between the frame and the electronic component, the encapsulant filling a first portion of the through-hole of the frame;
a third metal layer disposed directly on a lower surface of the frame;
a metal plate disposed above the electronic component and the frame;
an adhesive layer interposed between the metal plate and the electronic component, and between the metal plate and the frame, the adhesive layer including a second adhesive layer including a solder; and
a redistribution layer disposed below the electronic component and the frame, and electrically connected to the electronic component.