ELECTRONIC COMPONENT PACKAGE
An electronic component package includes: a lower package, including a frame including a through-hole and a through-wiring, a first electronic component disposed in the through-hole of the frame, a redistribution layer disposed below the first electronic component and the frame and electrically connected to the first electronic component, and an encapsulant filling the through-hole to encapsulate the first electronic component; an upper package disposed on the lower package and including a second electronic component; and a passive element disposed between the upper package and the lower package.
1 . An electronic component package comprising:
a lower package including a frame including a through-hole and a through-wiring, a first electronic component disposed in the through-hole of the frame, a redistribution layer disposed below the first electronic component and the frame and electrically connected to the first electronic component, and an encapsulant filling the through-hole to encapsulate the first electronic component;
an upper package disposed on the lower package and including a second electronic component; and
a passive element disposed between the upper package and the lower package.
2 . The electronic component package of claim 1 , further comprising a conductive adhesive layer connecting the upper package and the lower package to each other.
3 . The electronic component package of claim 2 , wherein the conductive adhesive layer is a solder.
4 . The electronic component package of claim 2 , wherein a height of the conductive adhesive layer is higher than that of the passive element.
5 . The electronic component package of claim 4 , wherein the passive element is disposed to be spaced apart from the upper package.
6 . The electronic component package of claim 1 , further comprising a plurality of conductive adhesive layers connecting the upper package and the lower package to each other and surrounding the passive element.
7 . The electronic component package of claim 1 , wherein the passive element is mounted on the lower package, and is electrically connected to the lower package.
8 . The electronic component package of claim 1 , further comprising an additional passive element disposed below the lower package.
9 . The electronic component package of claim 1 , wherein the through-wiring electrically connects the upper package and the lower package to each other.
10 . The electronic component package of claim 9 , wherein the encapsulant covers an upper portion of the frame, and the lower package further includes a conductive via penetrating therethrough a portion of the encapsulant covering the upper portion of the frame and electrically connected to the through-wiring.
11 . The electronic component package of claim 1 , wherein the first electronic component is an active element, and the second electronic component is a memory element.
12 . The electronic component package of claim 1 , wherein the passive element is connected to the first electronic component by power patterns of wiring layers included in the lower package.
13 . The electronic component package of claim 12 , wherein the passive element is a decoupling capacitor.