FAN-OUT SEMICONDUCTOR PACKAGE

1 . A fan-out semiconductor package comprising:

a semiconductor chip;

a passive element disposed side by side with the semiconductor chip in a horizontal direction;

a redistribution member electrically connected to the semiconductor chip and the passive element and disposed beneath the semiconductor chip and the passive element, the redistribution member comprising passive element connection vias having a rectangular transverse cross section for electrically connecting the passive element; and

an encapsulant encapsulating the semiconductor chip and the passive element.

2 . The fan-out semiconductor package of claim 1 , wherein the passive element connection via has the same width as that of an external electrode provided on the passive element.

3 . The fan-out semiconductor package of claim 1 , wherein a portion of the passive element connection via relatively closer to an external electrode of the passive element has the same width as that of the external electrode provided on the passive element, and an portion of the passive element connection via relatively closer to the redistribution member has a width greater than that of the external electrode provided on the passive element.

4 . The fan-out semiconductor package of claim 1 , wherein a plurality of passive element connection vias are disposed side by side in a length direction on each external electrode disposed on opposite end portions of the passive element.

5 . The fan-out semiconductor package of claim 4 , wherein the plurality of passive element connection vias are disposed to be spaced apart from each other in a length direction.

6 . The fan-out semiconductor package of claim 1 , wherein the redistribution member includes chip connection vias connected to the semiconductor chip, and the chip connection vias are disposed to be spaced apart from the passive element connection vias.

7 . The fan-out semiconductor package of claim 6 , wherein a longitudinal cross section of the chip connection via has any one of a tapered shape and a cylindrical shape.

8 . The fan-out semiconductor package of claim 1 , further comprising a core member including a through-hole in which the semiconductor chip and the passive element are disposed.

9 . The fan-out semiconductor package of claim 8 , wherein the core member includes an insulating layer in which the through-hole is formed, a redistribution layer formed on at least one of an upper surface and a lower surface of the insulating layer, and connection vias connected to the redistribution layer.

10 . The fan-out semiconductor package of claim 1 , further comprising a core member including a first through-hole in which the semiconductor chip is disposed and a second through-hole, disposed to be spaced apart from the first through-hole and in which the passive element is disposed.

11 . The fan-out semiconductor package of claim 10 , wherein the redistribution member includes chip connection vias connected to the semiconductor chip and the passive element connection vias connected to the passive element.

12 . The fan-out semiconductor package of claim 11 , wherein a longitudinal cross section of the chip connection via has any one of a tapered shape and a cylindrical shape, and the passive element connection via has the same width as that of an external electrode provided on the passive element.

13 . The fan-out semiconductor package of claim 8 , wherein the core member only includes an insulating layer.

14 . The fan-out semiconductor package of claim 1 , wherein the redistribution member includes one or more insulating layers, one or more redistribution layers disposed in the insulating layer, and vias connecting the redistribution layers to each other.

15 . A fan-out semiconductor package, comprising:

a redistribution member comprising passive element connection vias and chip connection vias exposed to a first surface of the redistribution member, the passive element connection vias having a rectangular cross-section when viewed in a plane perpendicular to the first surface in a length direction, the chip connection vias and the passive element connection vias penetrating a thickness of the redistribution member perpendicular to the first surface;

a semiconductor chip having connection pads disposed on the redistribution member such that the connection pads face the first surface and are electrically connected to the chip connection vias;

a passive element disposed adjacent the semiconductor chip along the first surface, having external electrodes spaced apart from each other in the length direction, electrically connected to corresponding passive element connection vias; and

an encapsulant encapsulating the semiconductor chip and the passive element.

16 . The fan-out semiconductor package of claim 15 , wherein the redistribution member further comprises an insulating layer having the first surface and a redistribution wiring layer, wherein the chip connection vias and the passive element connection vias respectively electrically connect the semiconductor chip and the passive element to the redistribution wiring layer.

17 . The fan-out semiconductor package of claim 15 , wherein each external electrode of the passive element contacts a plurality of passive element connection vias spaced apart from each other in a width direction perpendicular to the length direction.

18 . The fan-out semiconductor package of claim 15 , wherein a portion of each of the passive element connection vias relatively closer to the corresponding external electrode along the thickness of the redistribution member has a smaller area than a portion relatively farther from the corresponding external electrode along the thickness of the redistribution member.