Patent Assignment
Reel/Frame 039109/0556
Assignment of Assignor's Interest
Recorded: 2016-07-08
Pages: 5
Assignors
JEONG, SUNG WON
Executed: 2016-05-02
KIM, JI HOON
Executed: 2016-05-02
KIM, SUN HO
Executed: 2016-05-03
SEO, SHANG HOON
Executed: 2016-05-03
KOOK, SEUNG YEOP
Executed: 2016-05-02
ROMERO, CHRISTIAN
Executed: 2016-05-02
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Package Having Stress Alleviation Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.