Fan-out semiconductor package
A fan-out semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip. The connection member includes a plurality of insulating layers, a plurality of redistribution layers disposed on the plurality of insulating layers, respectively, and a plurality of via layers penetrating through the plurality of insulating layers, respectively, and at least two of the plurality of insulating layers or at least two of the plurality of via layers have different thicknesses.
1. A fan-out semiconductor package comprising:
a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface;
an encapsulant encapsulating at least portions of the semiconductor chip;
a first connection member disposed on the active surface of the semiconductor chip,
wherein the first connection member includes a plurality of insulating layers and a plurality of redistribution layers disposed on the plurality of insulating layers, respectively, and electrically connected to the connection pads, and
at least two of the plurality of insulating layers have different thicknesses,
wherein the plurality of insulating layers include a first insulating layer disposed on the active surface of the semiconductor chip and a second insulating layer disposed on the first insulating layer, and
the plurality of redistribution layers include a first redistribution layer disposed on the first insulating layer and a second redistribution layer disposed on the second insulating layer; and
a passivation layer disposed on the second insulating layer of the first connection member, and
t 1 <t 2 <t 3 is satisfied, in which t 1 is a thickness of the first, insulating layer, t 2 is a thickness of the second insulating layer, and t 3 is a thickness of the passivation layer.
2. The fan-out semiconductor package of claim 1 , wherein all of the passivation layer and the insulating layers have different thicknesses.
3. The fan-out semiconductor package of claim 1 , wherein t 2 /t 1 is 1.5 to 2, and t 3 /t 1 is 2.5 to 3.
4. The fan-out semiconductor package of claim 1 , further comprising:
an underbump metal layer formed in openings of the passivation layer; and
connection terminals disposed on the passivation layer and connected to the underbump metal layer,
wherein at least one of the connection terminals is disposed in a fan-out region.
5. The fan-out semiconductor package of claim 1 , further comprising a second connection member having a through-hole,
wherein the semiconductor chip is disposed in the through-hole.
6. The fan-out semiconductor package of claim 5 , wherein the second connection member includes a third insulating layer, a third redistribution layer in contact with the first connection member and embedded in the third insulating layer, and a fourth redistribution layer disposed on the other surface of the third insulating layer opposing one surface of the third insulating layer in which the third redistribution layer is embedded, and
the third and fourth redistribution layers are electrically connected to the connection pads.
7. The fan-out semiconductor package of claim 6 , wherein a distance between the redistribution layer of the first, connection member and the third redistribution layer is greater than that between the redistribution layer of the first connection member and the connection pad of the semiconductor chip.
8. The fan-out semiconductor package of claim 6 , wherein the second connection member further includes a fourth insulating layer disposed on the third insulating layer and covering the fourth redistribution layer and a fifth redistribution layer disposed on the fourth insulating layer, and
the fifth redistribution layer is electrically connected to the connection pads.
9. The fan-out semiconductor package of claim 5 , wherein the second connection member includes a third insulating layer, a third redistribution layer and a fourth redistribution layer disposed on opposite surfaces of the third insulating layer, respectively, a fourth insulating layer disposed on the third insulating layer and covering the third redistribution layer, and a fifth redistribution layer disposed on the fourth insulating layer, and
the third to fifth redistribution layers are electrically connected to the connection pads.
10. The fan-out semiconductor package of claim 9 , wherein the third insulating layer has a thickness greater than that of the fourth insulating layer.
11. The fan-out semiconductor package of claim 9 , wherein the second connection member further includes a fifth insulating layer disposed on the third insulating layer and covering the fourth redistribution layer and a sixth redistribution layer disposed on the fifth insulating layer, and
the sixth redistribution layer is electrically connected to the connection pads.
12. A fan-out semiconductor package comprising:
a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface;
an encapsulant encapsulating at least portions of the semiconductor chip;
a connection member disposed on the active surface of the semiconductor chip,
wherein the connection member includes a plurality of insulating layers, a plurality of redistribution layers disposed on the plurality of insulating layers, respectively, and a plurality of via layers penetrating through the plurality of insulating layers, respectively, and
at least two of the plurality of via layers have different thicknesses;
a passivation layer disposed on the connection member; and
an underbump metal layer formed in openings of the passivation layer,
wherein the underbump metal layer has a thickness different from that of at least one of the plurality of via layers,
the plurality of insulating layers include a first insulating layer disposed on the active surface of the semiconductor chip and a second insulating layer disposed on the first insulating layer,
the plurality of redistribution layers include a first redistribution layer disposed on the first insulating layer and a second redistribution layer disposed on the second insulating layer,
the plurality of via layers include a first via layer penetrating through the first insulating layer and connecting the connection pads and the first redistribution layer to each other and a second via layer penetrating through the second insulating layer and connecting the first redistribution layer and the second redistribution layer to each other,
the passivation layer is disposed on the second insulating layer, and
T 1 <T 2 <T 3 is satisfied, in which T 1 is a thickness of the first via layer, T 2 is a thickness of the second via layer, and T 3 is a thickness of the underbump metal layer.
13. The fan-out semiconductor package of claim 12 , wherein all of the underbump metal layer and the plurality of via layers have different thicknesses.
14. The fan-out semiconductor package of claim 12 , wherein T 2 /T 1 is 1.5 to 2 and T 3 /T 1 is 2.5 to 3.