BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE
Aboard for an electronic component package includes a wiring part on which an electronic component is disposed, wherein the wiring part includes an insulating layer, a signal transferring wiring electrically connected to the electronic component, and an electrical testing wiring electrically disconnected from the electronic component, and the electrical testing wiring includes conductive patterns formed on both surfaces of the wiring part, and conductive vias electrically connecting the conductive patterns to each other.
1 . An electronic component package comprising:
a wiring part;
an electronic component disposed on the wiring part; and
an encapsulant protecting the electronic component,
wherein the wiring part includes an insulating layer and a signal transferring wiring electrically connected to the electronic component,
an uppermost portion of the signal transferring wiring is disposed on an uppermost portion of the insulating layer and is partially embedded in the encapsulant, and
a lowermost portion of the signal transferring wiring is partially embedded in a lowermost portion of the insulating layer.
2 . The electronic component package of claim 1 , further comprising a plurality of conductive posts disposed on the uppermost portion of the signal transferring wiring and electrically connected therewith.
3 . The electronic component package of claim 2 , wherein the electronic component is surrounded by the plurality of conductive posts.
4 . The electronic component package of claim 2 , further comprising conductive vias disposed on the plurality of conductive posts, being electrically connected therewith, and partially embedded in the encapsulant.
5 . The electronic component package of claim 4 , further comprising conductive patterns disposed on the conductive vias and being electrically connected therewith.
6 . The electronic component package of claim 1 , wherein the wiring part has a plurality of stacked insulating layers.
7 . The electronic component package of claim 1 , wherein the wiring part further has an electrical testing wiring electrically disconnected from the electronic component.
8 . The electronic component package of claim 7 , wherein conductive patterns belonging to the electrical testing wiring are electrically disconnected from conductive patterns belonging to the signal transferring wiring.
9 . The electronic component package of claim 1 , wherein the wiring part includes a first wiring part and a second wiring part between the first wiring part and the electronic component, and the smallest interval between conductive patterns included in the second wiring part is smaller than the smallest interval between conductive patterns included in the first wiring part.
10 . The electronic component package of claim 9 , wherein materials of insulating layers respectively included in the first and second wiring parts are different from each other.
11 . The electronic component package of claim 10 , wherein the insulating layer included in the second wiring part is formed of a photo-curable material, and the insulating layer included in the first wiring part is formed of a material including pre-preg or Ajinomoto build-up film (ABF).