Patent Assignment
Reel/Frame 046001/0933
Assignment of Assignor's Interest
Recorded: 2018-06-06
Pages: 4
Assignors
BAEK, YONG HO
Executed: 2016-05-13
CHO, JUNG HYUN
Executed: 2016-05-13
CHOI, JAE HOON
Executed: 2016-05-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Board for Electronic Component Package, Electronic Component Package, and Method of Manufacturing Board for Electronic Component Package
Application:
16/000,200 →
Publication:
US 2018/0286770
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.