Patent Assignment
Reel/Frame 040239/0877
Assignment of Assignor's Interest
Recorded: 2016-10-05
Pages: 5
Assignors
LEE, DOO HWAN
Executed: 2016-09-21
OH, KYUNG SEOB
Executed: 2016-09-21
KIM, JONG RIP
Executed: 2016-09-21
KIM, HYOUNG JOON
Executed: 2016-09-21
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.