CLEANING COMPOSITION AND CLEANING METHOD OF ELECTRONIC COMPONENT USING THE SAME
A cleaning composition contains: 0.5 to 5 wt % of an acid; 1 to 20 wt % of an amine-based compound; 0.2 to 5 wt % of a corrosion inhibitor including a silane-based compound; and a balance of pure water. A cleaning composition contains: 1 to 10 wt % of a quaternary alkyl ammonium compound; 0.5 to 5 wt % of a corrosion inhibitor including at least one selected from the group consisting of a silane-based compound, an ammonium nitrate compound, and an ammonium phosphate compound; and a balance of pure water.
1 . A cleaning composition comprising:
0.5 to 5 wt % of an acid, based on a total weight of the cleaning composition;
1 to 20 wt % of an amine-based compound, based on the total weight of the cleaning composition;
0.2 to 5 wt % of a corrosion inhibitor including a silane-based compound, based on the total weight of the cleaning composition; and
a balance of pure water.
2 . The cleaning composition of claim 1 , wherein the acid is at least one selected from the group consisting of sulfuric acid, nitric acid, hydrochloric acid, hydrofluoric acid, acetic acid, and nitrous acid.
3 . The cleaning composition of claim 2 , wherein the acid is acetic acid, and the content of the acid is 0.5 to 1.5 wt %, based on the total weight of the cleaning composition.
4 . The cleaning composition of claim 1 , wherein the amine-based compound is at least one selected from the group consisting of an ammonia solution, alkyl amine, dialkyl amine, trialkyl amine, hydroxyalkyl amine, dihydroxyalkyl amine, and trihydroxyalkyl amine.
5 . The cleaning composition of claim 4 , wherein the amine-based compound is the ammonia solution, and the content of the amine-based compound is 10 to 15 wt %, based on the total weight of the cleaning composition.
6 . The cleaning composition of claim 1 , wherein the silane-based compound is at least one selected from the group consisting of compounds represented by the following [Chemical Formula 1] and [Chemical Formula 2] and compounds including a repeating unit represented by the following [Chemical Formula 3]:
where R 1 is a substituted or unsubstituted (C 1 -C 10 ) aliphatic chain,
R 2 to R 4 are each independently a substituted or unsubstituted (C 1 -C 10 ) aliphatic chain, a substituted or unsubstituted (C 1 -C 10 ) aliphatic ring, a substituted or unsubstituted (C 6 -C 20 ) aromatic ring, or a combination thereof, and
R 5 is hydrogen, a substituted or unsubstituted (C 1 -C 10 ) aliphatic chain, a substituted or unsubstituted (C 1 -C 10 ) aliphatic ring, a substituted or unsubstituted (C 6 -C 20 ) aromatic ring, or a combination thereof,
where R 6 to R 9 are each independently a substituted or unsubstituted (C 1 -C 10 ) aliphatic chain, a substituted or unsubstituted (C 1 -C 10 ) aliphatic ring, a substituted or unsubstituted (C 6 -C 20 ) aromatic ring, or a combination thereof, and
where R 10 and R 11 are each independently hydrogen, a substituted or unsubstituted (C 1 -C 10 ) aliphatic chain, a substituted or unsubstituted (C 1 -C 10 ) aliphatic ring, a substituted or unsubstituted (C 6 -C 20 ) aromatic ring, or a combination thereof; and
n is an integer of 1 to 2000.
7 . The cleaning composition of claim 6 , wherein the silane-based compound is at least one selected from the group consisting of the compounds represented by [Chemical Formula 1] and [Chemical Formula 2], and a content of the silane-based compound is 0.3 to 1 wt %, based on the total weight of the cleaning composition.
8 . The cleaning composition of claim 1 , wherein the cleaning composition has a pH of 9 to 12.
9 . A cleaning composition comprising:
1 to 10 wt % of a quaternary alkyl ammonium compound, based on a total weight of the cleaning composition;
0.5 to 5 wt % of a corrosion inhibitor including at least one selected from the group consisting of a silane-based compound, an ammonium nitrate compound, and an ammonium phosphate compound, based on the total weight of the cleaning composition; and
a balance of pure water.
10 . The cleaning composition of claim 9 , wherein a content of the silane-based compound is 0.1 to 1 wt %, based on the total weight of the cleaning composition, and a content of the ammonium nitrate compound or the ammonium phosphate compound is 0.4 to 4 wt %, based on the total weight of the cleaning composition.
11 . The cleaning composition of claim 9 , wherein a content of the ammonium nitrate compound or the ammonium phosphate compound is 0.5 to 5 wt %, based on the total weight of the cleaning composition.
12 . The cleaning composition of claim 9 , wherein the quaternary alkyl ammonium compound includes tetraalkyl ammonium hydroxide, and a content of the quaternary alkyl ammonium compound is 1 to 5 wt %, based on the total weight of the cleaning composition.
13 . The cleaning composition of claim 9 , wherein the silane-based compound is at least one selected from the group consisting of compounds represented by the following [Chemical Formula 1] and [Chemical Formula 2] and compounds including a repeating unit represented by the following [Chemical Formula 3], and
a content of the silane-based compound is 0.3 to 1 wt %, based on the total weight of the cleaning composition, and a content of the ammonium nitrate compound is 1 to 2 wt %, based on the total weight of the cleaning composition:
where R 1 is a substituted or unsubstituted (C 1 -C 10 ) aliphatic chain,
R 2 to R 4 are each independently a substituted or unsubstituted (C 1 -C 10 ) aliphatic chain, a substituted or unsubstituted (C 1 -C 10 ) aliphatic ring, a substituted or unsubstituted (C 6 -C 20 ) aromatic ring, or a combination thereof, and
R 5 is hydrogen, a substituted or unsubstituted (C 1 -C 10 ) aliphatic chain, a substituted or unsubstituted (C 1 -C 10 ) aliphatic ring, a substituted or unsubstituted (C 6 -C 20 ) aromatic ring, or a combination thereof,
where R 6 to R 9 are each independently a substituted or unsubstituted (C 1 -C 10 ) aliphatic chain, a substituted or unsubstituted (C 1 -C 10 ) aliphatic ring, a substituted or unsubstituted (C 6 -C 20 ) aromatic ring, or a combination thereof, and
where R 10 and R 11 are each independently hydrogen, a substituted or unsubstituted (C 1 -C 10 ) aliphatic chain, a substituted or unsubstituted (C 1 -C 10 ) aliphatic ring, a substituted or unsubstituted (C 6 -C 20 ) aromatic ring, or a combination thereof; and
n is an integer of 1 to 2000.
14 . The cleaning composition of claim 9 , further comprising 0.5 to 1.5 wt % of at least one acid selected from the group consisting of sulfuric acid, nitric acid, hydrochloric acid, hydrofluoric acid, acetic acid, and nitrous acid.
15 . The cleaning composition of claim 9 , wherein the cleaning composition has a pH of 9 to 12.
16 . A cleaning method of an electronic component, the cleaning method comprising:
preparing an electronic component having an active surface on which a connection pad is disposed and an inactive surface opposite to the active surface; and
cleaning a surface of the connection pad of the electronic component,
wherein the cleaning composition of claim 1 is used in the cleaning of the surface of the connection pad of the electronic component.