Patent Assignment
Reel/Frame 039066/0717
Assignment of Assignor's Interest
Recorded: 2016-07-01
Pages: 4
Assignors
BAEK, YONG HO
Executed: 2016-05-13
CHO, JUNG HYUN
Executed: 2016-05-13
CHOI, JAE HOON
Executed: 2016-05-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Board for Electronic Component Package, Electronic Component Package, and Method of Manufacturing Board for Electronic Component Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.