RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND INTEGRATED CIRCUIT PACKAGE, AND PRODUCT USING THE SAME
A resin composition for a printed circuit board and an integrated circuit (IC) package, and a product using the same is provided. The resin composition includes an epoxy resin composite comprising an epoxy group, the epoxy resin composite including 5 to 20 parts by weight of a bisphenol A type epoxy resin, 30 to 60 parts by weight of a cresol novolak epoxy resin, 20 to 35 parts by weight of a phosphorus-based flame-retardant epoxy resin, and 5 to 30 parts by weight of a rubber-modified epoxy resin, based on 100 parts by weight of the epoxy resin composite, an aminotriazine-based hardener, a hardening accelerator, a filler, and 0.01 to 5 parts by weight of a surface improving agent based on 100 parts by weight of the epoxy resin composite.
1 . A resin composition comprising:
an epoxy resin composite comprising 5 to 20 parts by weight of a bisphenol A type epoxy resin, 30 to 60 parts by weight of a cresol novolak epoxy resin, 20 to 35 parts by weight of a phosphorus-based flame-retardant epoxy resin, and 5 to 30 parts by weight of a rubber-modified epoxy resin, based on 100 parts by weight of the epoxy resin composite;
an aminotriazine-based hardener;
a hardening accelerator;
a filler; and
0.01 to 5 parts by weight of a surface improving agent based on 100 parts by weight of the epoxy resin composite.
2 . The resin composition of claim 1 , wherein the resin composition is implemented in at least one of a printed circuit board (PCB) and an integrated circuit (IC) package.
3 . The resin composition of claim 1 , wherein the epoxy resin composite comprises 5 to 15 parts by weight of the bisphenol A type epoxy resin, 50 to 60 parts by weight of the cresol novolak epoxy resin, 25 to 35 parts by weight of the phosphorus-based flame-retardant epoxy resin, and 5 to 20 parts by weight of the rubber-modified epoxy resin, based on 100 parts by weight of the epoxy resin composite.
4 . The resin composition of claim 1 , wherein an average epoxy resin equivalent of the bisphenol A type epoxy resin is 100 to 700 g/eq.
5 . The resin composition of claim 1 , wherein an average epoxy resin equivalent of the cresol novolak epoxy resin is 100 to 600 g/eq.
6 . The resin composition of claim 1 , wherein an average epoxy resin equivalent of the phosphorus-based flame-retardant epoxy resin is 400 to 800 g/eq.
7 . The resin composition of claim 1 , wherein an average epoxy resin equivalent of the rubber-modified epoxy resin is 100 to 500 g/eq.
8 . The resin composition of claim 1 , wherein the aminotriazine-based hardener is contained in an amount of 0.2 to 1.5 equivalent ratio based on a mixed equivalent of a sum of epoxy groups of the epoxy resin composite.
9 . The resin composition of claim 1 , wherein the hardening accelerator is contained in an amount of 0.1 to 1 part by weight based on 100 parts by weight of the epoxy resin composite.
10 . The resin composition of claim 1 , wherein the filler is contained in an amount of 20 to 50 parts by weight based on 100 parts by weight of the epoxy resin composite.
11 . The resin composition of claim 1 , wherein the filler is an organic filler.
12 . The resin composition of claim 1 , further comprising at least one of an antifoaming agent and a viscosity enhancer.
13 . An insulation film comprising the resin composition of claim 1 .
14 . The insulation film of claim 13 , wherein the insulation film is a build-up insulation film having a thickness of 100 μm or less.
15 . The insulation film of claim 13 , wherein the insulation film is a mold film having a thickness of 100 μm or more.
16 . The insulation film of claim 13 , wherein the insulation film is applied to at least one of a build-up layer of a printed circuit board, a mold layer of panel level packaging, and a redistribution layer.
17 . A product comprising the insulation film of claim 13 .
18 . The product of claim 17 , wherein the product is at least one of a printed circuit board and an integrated circuit (IC) package.