Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package
A board for an electronic component package includes a wiring part on which an electronic component is disposed, wherein the wiring part includes an insulating layer, a signal transferring wiring electrically connected to the electronic component, and an electrical testing wiring electrically disconnected from the electronic component, and the electrical testing wiring includes conductive patterns formed on both surfaces of the wiring part, and conductive vias electrically connecting the conductive patterns to each other.
1. An electronic component package comprising:
a wiring part including:
a plurality of insulating layers,
a signal transferring wiring including a plurality of first conductive patterns disposed on the plurality of insulating layers, and first vias penetrating through the plurality of insulating layers and electrically connecting the plurality of first conductive patterns to each other, and
an electrical testing wiring electrically isolated from the signal transferring wiring, and including a plurality of second conducive patterns disposed on the plurality of insulating layers and second vias penetrating through the plurality of insulating layers and electrically connecting the plurality of second conductive patterns to each other;
an electronic component disposed on the wiring part, electrically connected to the signal transferring wiring, and electrically isolated from the electrical testing wiring; and
an encapsulant disposed on the wiring part and encapsulating the electronic component,
wherein an uppermost portion of the signal transferring wiring is partially embedded in the encapsulant, and
an uppermost portion of the electrical testing wiring is partially embedded in the encapsulant, and an upper surface of the uppermost portion of the electrical testing wiring is entirely directly contacted with the encapsulant.
2. The electronic component package of claim 1 , wherein the wiring part includes a first wiring part and a second wiring part between the first wiring part and the electronic component, and a smallest interval between conductive patterns included in the second wiring part is smaller than a smallest interval between conductive patterns included in the first wiring part.
3. The electronic component package of claim 2 , wherein materials of insulating layers respectively included in the first and second wiring parts are different from each other.
4. The electronic component package of claim 1 , further comprising a conductive post at least partially embedded in the encapsulant and disposed on the signal transferring wiring and electrically connected to the electronic component through the wiring part.
5. The electronic component package of claim 4 , wherein the conductive post is interposed between a via formed thereon and a via of the wiring part which is electrically connected to the electronic component, and
a size of the via formed on the conductive post and a size of the via of the wiring part which is electrically connected to the electronic component both increase in a direction from the wiring part towards the encapsulant.
6. The electronic component package of claim 1 , wherein the electrical testing wiring is not disposed between any electrode pads of the electronic component.
7. The electronic component package of claim 1 , further comprising an outer layer completely covering a lower surface of a lowermost portion of the electrical testing wiring and having an opening partially exposing a lowermost portion of the signal transferring wiring.
8. The electronic component package of claim 7 , further comprising a connection terminal disposed in the opening of the outer layer and electrically connected to the lowermost portion of the signal transferring wiring.
9. The electronic component package of claim 1 , further comprising an electrically conductive adhesive electrically connecting a conductive pattern of the wiring part and an electrode pad of the electronic component to each other.
10. The electronic component package of claim 1 , wherein the electrical testing wiring is disposed closer to the electronic component than the signal transferring wiring disposed on an edge of the electronic component package.
11. The electronic component package of claim 1 , wherein any electronic component in the electronic component package is electrically isolated from the electrical testing wiring.
12. The electronic component package of claim 1 , wherein a width of each of the first vias increases in a direction from the wiring part towards the encapsulant, and
a width of each of the second vias increases in the direction from the wiring part towards the encapsulant.
13. An electronic component package comprising:
a wiring part including:
a plurality of insulating layers,
a signal transferring wiring including a plurality of first conductive patterns disposed on the plurality of insulating layers, and first vias penetrating through the plurality of insulating layers and electrically connecting the plurality of first conductive patterns to each other, and
an electrical testing wiring electrically isolated from the signal transferring wiring, and including a plurality of second conducive patterns disposed on the plurality of insulating layers and second vias penetrating through the plurality of insulating layers and electrically connecting the plurality of second conductive patterns to each other;
an electronic component disposed on the wiring part, electrically connected to the signal transferring wiring, and electrically isolated from the electrical testing wiring;
an outer layer completely covering a lower surface of a lowermost portion of the electrical testing wiring, and having an opening partially exposing a lowermost portion of the signal transferring wiring; and
a connection terminal disposed in the opening of the outer layer and electrically connected to the lowermost portion of the signal transferring wiring.
14. The electronic component package of claim 13 , wherein the electrical testing wiring is disposed closer to the electronic component than the signal transferring wiring disposed on an edge of the electronic component package.
15. The electronic component package of claim 13 , wherein any electronic component in the electronic component package is electrically isolated from the electrical testing wiring.
16. The electronic component package of claim 13 , further comprising an encapsulant disposed on the wiring part and encapsulating the electronic component,
wherein the encapsulant is in direct contact with the signal transferring wiring and the electrical testing wiring.
17. The electronic component package of claim 13 , wherein a width of each of the first vias increases in a direction from the outer layer towards the wiring part, and
a width of each of the second vias increases in the direction from the outer layer towards the wiring part.