Electronic component package and manufacturing method of the same
An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.
1. An electronic component package comprising:
first and second wiring parts each including an insulating layer, conductive patterns formed in the insulating layer, and a conductive via penetrating through the insulating layer, to be connected to the conductive patterns; and
an electronic component disposed between the first and second wiring parts and connected to the first wiring part,
wherein the first wiring part includes conductive patterns adjacent to the electronic component among the conductive patterns of the first wiring part, and the conductive patterns adjacent to the electronic component are embedded in a surface of the insulating layer of the first wiring part facing the electronic component,
the electronic component is mounted on the conductive pattern embedded in the surface of the insulating layer of the first wiring part facing the electronic component,
the insulating layer of the first wiring part is disposed below the electronic component, and
an upper surface of the conductive patterns adjacent to the electronic component is coplanar with the surface of the insulating layer of the first wiring part facing the electronic component.
2. The electronic component package of claim 1 , further comprising an encapsulant.
3. The electronic component package of claim 1 , wherein the conductive patterns of the first wiring part adjacent to the electronic component have a smaller pitch than those which are not adjacent to the electronic component.
4. The electronic component package of claim 1 , wherein the electronic component is disposed such that an electrode pad included in the electronic component is directed toward the first wiring part.
5. The electronic component package of claim 1 , wherein the first and second wiring parts include a photo curable material.
6. The electronic component package of claim 1 , wherein the first wiring part is thicker than the second wiring part.
7. The electronic component package of claim 1 , further comprising an adhesive layer.
8. The electronic component package of claim 7 , wherein the adhesive layer is a prepreg or a solder resist.
9. The electronic component package of claim 1 , further comprising an etch stop layer.
10. The electronic component package of claim 9 , wherein the etch stop layer is formed of a metal, and is electrically isolated from the electronic component.
11. The electronic component package of claim 1 , further comprising an additional electronic component embedded in the first wiring part.
12. The electronic component package of claim 11 , wherein the electronic component is an active element, and
the additional electronic component is a passive element.
13. The electronic component package of claim 1 , wherein the electronic component and the conductive pattern are connected by an adhesive and an electrical connection part.
14. The electronic component package of claim 13 , wherein the electrical connection part is a solder.
15. The electronic component package of claim 13 , wherein the adhesive is an underfill resin or an insulating epoxy.
16. An electronic component package comprising:
first and second wiring parts each including an insulating layer, conductive patterns formed in the insulating layer, and a conductive via penetrating through the insulating layer, to be connected to the conductive patterns, and
an electronic component disposed between the first and second wiring parts and connected to the first wiring part,
wherein the first wiring part includes conductive patterns adjacent to and disposed below the electronic component among the conductive patterns of the first wiring part,
the conductive patterns adjacent to and disposed below the electronic component are partially embedded in the insulating layer of the first wiring part and upper surfaces thereof are exposed from the insulating layer of the first wiring part,
the electronic component is mounted on the conductive pattern embedded in a surface of the insulating layer of the first wiring part facing the electronic component, and
an upper surface of the conductive patterns adjacent to the electronic component is coplanar with the surface of the insulating layer of the first wiring part facing the electronic component.