Patent Assignment
Reel/Frame 049085/0588
Assignment of Assignor's Interest
Recorded: 2019-05-04
Pages: 4
Assignors
BAEK, YONG HO
Executed: 2016-12-05
KIM, SANG KUN
Executed: 2016-12-05
KIM, YE JEONG
Executed: 2016-12-05
LEE, JAE EAN
Executed: 2016-12-05
CHOI, JAE HOON
Executed: 2016-12-05
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Package and Manufacturing Method of the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.