Electronic component package and method of manufacturing the same
An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.
1. An electronic component package comprising:
a frame having a cavity;
an electronic component disposed in the cavity of the frame;
a first metal layer disposed on an inner wall of the cavity of the frame;
a second metal layer disposed on a lower surface of the frame;
a third metal layer disposed on an upper surface of the frame;
an encapsulant encapsulating at least a portion of the electronic component; and
a redistribution layer disposed below the frame and the electronic component,
wherein a lower surface of the encapsulant is substantially coplanar with lower surfaces of the electronic component, the first metal layer and second metal layer.
2. The electronic component package of claim 1 , wherein the first metal layer encloses around side surfaces of the electronic component.
3. The electronic component package of claim 2 , wherein the first metal layer entirely covers the inner wall of the cavity of the frame.
4. The electronic component package of claim 1 , wherein the second metal layer is connected to the first metal layer.
5. The electronic component package of claim 1 , wherein the second metal layer entirely covers the lower surface of the frame.
6. The electronic component package of claim 1 , wherein the third metal layer is connected to the first metal layer.
7. The electronic component package of claim 1 , wherein the third metal layer entirely covers the upper surface of the frame.
8. The electronic component package of claim 1 , wherein the second and third metal layers are redistribution patterns or dummy patterns.
9. The electronic component package of claim 8 , further comprising a penetration wiring defining a via through the frame.
10. The electronic component package of claim 1 , further comprising:
an external layer disposed below the redistribution layer and having an opening; and
an external connection terminal disposed in the opening,
wherein at least one external connection terminal is disposed in a fan-out region.
11. The electronic component package of claim 1 , wherein the encapsulant fills a space in the cavity of the frame while covering upper portions of the frame and the electronic component.
12. The electronic component package of claim 11 , wherein the encapsulant encloses outer side surfaces of the frame, and the frame is not externally exposed.