Patent Assignment
Reel/Frame 038096/0236
Assignment of Assignor's Interest
Recorded: 2016-03-24
Pages: 2
Assignors
LAKHERA, NISHANT
Executed: 2016-03-17
KALANDAR, NAVAS KHAN ORATTI
Executed: 2016-03-17
SINGH, AKHILESH K.
Executed: 2016-03-17
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON WEST, AUSTIN, TEXAS, 78735
Covered Property
(1)
Apparatus and Methods for Multi-Die Packaging
Application:
15/080,162 →
Publication:
US 2017/0278825
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement to the Security Agreement
Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
Change of Name
Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040626 Frame: 0683. Assignor(S) Hereby Confirms the Merger and Change of Name Effective November 7, 2016.
Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
Release of Security Interest
Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →