Patent Assignment
Reel/Frame 038111/0838
Assignment of Assignor's Interest
Recorded: 2016-03-28
Pages: 3
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming a Package In-Fan Out Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.