Patent Assignment
Reel/Frame 038114/0357
Assignment of Assignor's Interest
Recorded: 2016-03-28
Pages: 4
Assignors
WU, KUO-MING
Executed: 2016-02-23
LIN, YUNG-LUNG
Executed: 2016-02-23
WANG, ZHI-YANG
Executed: 2016-02-23
CHEN, SHENG-CHAU
Executed: 2016-02-23
CHOU, CHENG-HSIEN
Executed: 2016-02-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3DIC Structure and Methods of Forming