IP Library › Assignment 038125/0873
Patent Assignment
Reel/Frame 038125/0873

Assignment of Assignor's Interest

Recorded: 2016-03-29 Pages: 12
Assignors
ANDRY, PAUL S.
Executed: 2016-03-25
DANG, BING
Executed: 2016-03-29
GELORME, JEFFREY DONALD
Executed: 2016-03-29
HUNG, LI-WEN
Executed: 2016-03-25
KNICKERBOCKER, JOHN U.
Executed: 2016-03-28
YANG, CORNELIA TSANG
Executed: 2016-03-25
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Handler Bonding and Debonding for Semiconductor Dies
Patent: 9,947,570 →
Application: 15/083,665 →
Publication: US 2017/0194186