Patent Assignment
Reel/Frame 038141/0465
Assignment of Assignor's Interest
Recorded: 2016-03-30
Pages: 5
Assignee
TRIQUINT SEMICONDUCTOR, INC.
2300 NE BROOKWOOD PARKWAY, HILLSBORO, OREGON, 97124
Covered Property
(1)
Hollow-Cavity Flip-Chip Package with Reinforced Interconnects and Process for Making the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.