IP Library Assignment 038174/0157
Patent Assignment
Reel/Frame 038174/0157

Assignment of Assignor's Interest

Recorded: 2016-04-01 Pages: 5
Assignors
MATSUMOTO, HIROIE
Executed: 2016-04-01
METZ, ANDREW W
Executed: 2016-03-31
FEURPRIER, YANNICK
Executed: 2016-03-31
LUTKER-LEE, KATIE
Executed: 2016-03-31
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, AKASAKA BIZ TOWER, TOKYO, 107-6325, JAPAN
Covered Property (1)
Trench and Hole Patterning with Euv Resists Using Dual Frequency Capacitively Coupled Plasma (Ccp)
Patent: 9,607,834 →
Application: 15/088,701 →
Publication: US 2016/0293405