Patent Assignment
Reel/Frame 038176/0414
Assignment of Assignor's Interest
Recorded: 2016-04-01
Pages: 3
Assignors
TRINH, HAI-DANG
Executed: 2015-11-13
TSAI, CHENG-YUAN
Executed: 2015-11-13
LIN, HSING-LIEN
Executed: 2015-11-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6,, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Resistive Ram Structure and Method of Fabrication Thereof