Patent Assignment
Reel/Frame 038199/0026
Assignment of Assignor's Interest
Recorded: 2016-04-05
Pages: 6
Assignors
HEO, JUNGHUN
Executed: 2016-01-25
CHO, MYUNGCHUL
Executed: 2016-01-25
CHOI, YOUN-SIK
Executed: 2016-01-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
System on Chip Receiving Supply Volage(S) via Merged Power Rail, and Mobile System Including Same