Patent Assignment
Reel/Frame 038200/0744
Assignment of Assignor's Interest
Recorded: 2016-04-06
Pages: 2
Assignor
SHIMIZU, KEISUKE
Executed: 2016-03-28
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Semiconductor Element Built-in Wiring Board and Method for Manufacturing the Same